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Kenneth E. GoodsonStanford Mechanical Engineering, Davies Provostial Professor在 stanford.edu 的电子邮件经过验证- Jyothi S. SadhuUniversity of Illinois at Urbana Champaign在 illinois.edu 的电子邮件经过验证
- Eric PopPease-Ye Professor of Electrical Eng., Materials Sci., App. Phys., Stanford & SLAC在 stanford.edu 的电子邮件经过验证
- Bruno AzeredoArizona State University在 asu.edu 的电子邮件经过验证
- Marc G. GhossoubIntel Corporation, University of Illinois at Urbana-Champaign在 intel.com 的电子邮件经过验证
- Myunghoon SeongUniversity of Illinois at Urbana-Champaign在 illinois.edu 的电子邮件经过验证
- David G. CahillDepartment of Materials Science and Engineering, University of Illinois at Urbana-Champaign在 illinois.edu 的电子邮件经过验证
- Krishna Vasanth ValavalaIntel Corporation, University of Illinois at Urbana Champaign在 illinois.edu 的电子邮件经过验证
- Xiuling LiUniversity of Texas at Austin在 utexas.edu 的电子邮件经过验证
- Paul V. BraunProfessor of Materials Science and Engineering, University of Illinois at Urbana-Champaign在 illinois.edu 的电子邮件经过验证
- Nick FangProfessor of Mechanical Engineering, HKU (current); previous: MIT, UCLA, UIUC在 hku.hk 的电子邮件经过验证
- Simon PhillpotDistinguished Professor of Materials Science & Engineering, University of Florida在 mse.ufl.edu 的电子邮件经过验证
- Ravi M.RIndian Institute of Technology Delhi在 iitd.ac.in 的电子邮件经过验证
- Richard T. HaaschMaterials Research Laboratory, University of Illinois在 illinois.edu 的电子邮件经过验证
- Jae Cheol ShinProfessor at Division of Electrical and Electronics Engineering at Dongguk University在 dgu.ac.kr 的电子邮件经过验证
- Debashis ChandaUniversity of Central Florida在 ucf.edu 的电子邮件经过验证
- Joseph P FeserUniversity of Delaware, Mechanical Engineering在 udel.edu 的电子邮件经过验证
- Mehdi AsheghiAdjunct Professor of Mechanical Engineerig, Stanford University在 stanford.edu 的电子邮件经过验证
- Hasan BabaeiProject Scientist, UC Berkeley在 berkeley.edu 的电子邮件经过验证
- Jay M. KhodadadiAuburn University在 auburn.edu 的电子邮件经过验证
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Sanjiv Sinha
Asst. Professor of Mechanical Engineering, University of Illinois
在 illinois.edu 的电子邮件经过验证