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Mark A Tschopp
Mark A Tschopp
Senior Research Scientist, Army Research Laboratory
在 mail.mil 的电子邮件经过验证 - 首页
标题
引用次数
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年份
Molecular dynamics simulations of deformation mechanisms of amorphous polyethylene
D Hossain, MA Tschopp, DK Ward, JL Bouvard, P Wang, MF Horstemeyer
Polymer 51 (25), 6071-6083, 2010
4732010
Probing grain boundary sink strength at the nanoscale: Energetics and length scales of vacancy and interstitial absorption by grain boundaries in -Fe
MA Tschopp, KN Solanki, F Gao, X Sun, MA Khaleel, MF Horstemeyer
Physical Review B 85 (6), 064108, 2012
3592012
Asymmetric tilt grain boundary structure and energy in copper and aluminium
MA Tschopp, DL McDowell
Philosophical Magazine 87 (25), 3871-3892, 2007
3242007
Structures and energies of asymmetric tilt grain boundaries in copper and aluminium
MA Tschopp, DL McDowell
Philosophical Magazine 87 (22), 3147-3173, 2007
3002007
Tensile strength of and tilt bicrystal copper interfaces
DE Spearot, MA Tschopp, KI Jacob, DL McDowell
Acta Materialia 55 (2), 705-714, 2007
294*2007
Porosity prediction: Supervised-learning of thermal history for direct laser deposition
M Khanzadeh, S Chowdhury, M Marufuzzaman, MA Tschopp, L Bian
Journal of Manufacturing Systems 47, 69-82, 2018
2822018
In-situ monitoring of melt pool images for porosity prediction in directed energy deposition processes
M Khanzadeh, S Chowdhury, MA Tschopp, HR Doude, M Marufuzzaman, ...
IISE Transactions 51 (5), 437-455, 2019
2572019
Effect of grain boundaries on texture formation during dynamic recrystallization of magnesium alloys
CD Barrett, A Imandoust, AL Oppedal, K Inal, MA Tschopp, H El Kadiri
Acta Materialia 128, 270-283, 2017
2192017
Influence of single crystal orientation on homogeneous dislocation nucleation under uniaxial loading
MA Tschopp, DL McDowell
Journal of the Mechanics and Physics of Solids 56 (5), 1806-1830, 2008
2152008
Symmetric and asymmetric tilt grain boundary structure and energy in Cu and Al (and transferability to other fcc metals)
MA Tschopp, SP Coleman, DL McDowell
Integrating Materials and Manufacturing Innovation 4, 176-189, 2015
1992015
Atomistic simulations of homogeneous dislocation nucleation in single crystal copper
MA Tschopp, DE Spearot, DL McDowell
Modelling and Simulation in Materials Science and Engineering 15 (7), 693, 2007
1602007
Quantifying geometric accuracy with unsupervised machine learning: Using self-organizing map on fused filament fabrication additive manufacturing parts
M Khanzadeh, P Rao, R Jafari-Marandi, BK Smith, MA Tschopp, L Bian
Journal of Manufacturing Science and Engineering 140 (3), 031011, 2018
1592018
Dislocation nucleation in asymmetric tilt grain boundaries
MA Tschopp, DL McDowell
International Journal of Plasticity 24 (2), 191-217, 2008
1532008
Mitigating grain growth in binary nanocrystalline alloys through solute selection based on thermodynamic stability maps
KA Darling, MA Tschopp, BK VanLeeuwen, MA Atwater, ZK Liu
Computational Materials Science 84, 255-266, 2014
1492014
Dual process monitoring of metal-based additive manufacturing using tensor decomposition of thermal image streams
M Khanzadeh, W Tian, A Yadollahi, HR Doude, MA Tschopp, L Bian
Additive Manufacturing 23, 443-456, 2018
1442018
Atomic-scale analysis of liquid-gallium embrittlement of aluminum grain boundaries
M Rajagopalan, MA Bhatia, MA Tschopp, DJ Srolovitz, KN Solanki
Acta Materialia 73, 312-325, 2014
1402014
Breakdown of the Schmid law in homogeneous and heterogeneous nucleation events of slip and twinning in magnesium
CD Barrett, H El Kadiri, MA Tschopp
Journal of the Mechanics and Physics of Solids 60 (12), 2084-2099, 2012
1362012
Structure and free volume of symmetric tilt grain boundaries with the E structural unit
MA Tschopp, GJ Tucker, DL McDowell
Acta Materialia 55 (11), 3959-3969, 2007
1362007
Grain boundary dislocation sources in nanocrystalline copper
MA Tschopp, DL McDowell
Scripta Materialia 58 (4), 299-302, 2008
1312008
Microstructure and mechanical properties of bulk nanostructured Cu–Ta alloys consolidated by equal channel angular extrusion
KA Darling, MA Tschopp, RK Guduru, WH Yin, Q Wei, LJ Kecskes
Acta Materialia 76, 168-185, 2014
1292014
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