| A 3D-IC technology with integrated microchannel cooling D Sekar, C King, B Dang, T Spencer, H Thacker, P Joseph, M Bakir, ... 2008 International Interconnect Technology Conference, 13-15, 2008 | 393 | 2008 |
| Method of constructing a semiconductor device and structure Z Or-Bach, DC Sekar, B Cronquist, I Beinglass, Z Wurman, P Lim US Patent 8,273,610, 2012 | 302 | 2012 |
| Bottom electrodes for use with metal oxide resistivity switching layers DC Sekar, F Kreupl, RS Makala US Patent 8,354,660, 2013 | 263 | 2013 |
| Semiconductor device and structure Z Or-Bach, B Cronquist, I Beinglass, JL De Jong, DC Sekar, P Lim US Patent 8,362,482, 2013 | 171 | 2013 |
| Method of forming three dimensional integrated circuit devices using layer transfer technique Z Or-Bach, D Sekar, B Cronquist, Z Wurman US Patent 8,642,416, 2014 | 156 | 2014 |
| Integrated microfluidic cooling and interconnects for 2D and 3D chips B Dang, MS Bakir, DC Sekar, CR King, JD Meindl IEEE Transactions on Advanced Packaging 33 (1), 79-87, 2010 | 153 | 2010 |
| 3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation MS Bakir, C King, D Sekar, H Thacker, B Dang, G Huang, A Naeemi, ... 2008 IEEE Custom Integrated Circuits Conference, 663-670, 2008 | 136 | 2008 |
| Semiconductor device and structure Z Or-Bach, B Cronquist, I Beinglass, JL De Jong, DC Sekar US Patent 8,541,819, 2013 | 132 | 2013 |
| Semiconductor device and structure Z Or-Bach, B Cronquist, I Beinglass, JL De Jong, DC Sekar, Z Wurman US Patent 8,395,191, 2013 | 120 | 2013 |
| Punch-through diode steering element A Mihnea, DC Sekar, G Samachisa, R Scheuerlein, L Xiao US Patent 8,274,130, 2012 | 118 | 2012 |
| 3D stacking of chips with electrical and microfluidic I/O interconnects CR King, D Sekar, MS Bakir, B Dang, J Pikarsky, JD Meindl 2008 58th Electronic Components and Technology Conference, 1-7, 2008 | 115 | 2008 |
| Semiconductor system and device Z Or-Bach, D Sekar, B Cronquist, Z Wurman US Patent 9,219,005, 2015 | 110 | 2015 |
| Method for fabrication of a semiconductor device and structure Z Or-Bach, DC Sekar, B Cronquist US Patent 8,557,632, 2013 | 110 | 2013 |
| Integrated circuit device and structure Z Or-Bach, DC Sekar, B Cronquist US Patent 9,099,526, 2015 | 108 | 2015 |
| Method for fabrication of a semiconductor device and structure Z Or-Bach, DC Sekar, B Cronquist, I Beinglass, JL De Jong US Patent 8,058,137, 2011 | 102 | 2011 |
| Programming reversible resistance switching elements DC Sekar, K Schuegraf, R Scheuerlein US Patent 8,498,146, 2013 | 100 | 2013 |
| Forming-free nitrogen-doped AlOX RRAM with sub-μA programming current W Kim, SI Park, Z Zhang, Y Yang-Liauw, D Sekar, HSP Wong, SS Wong 2011 Symposium on VLSI Technology-Digest of Technical Papers, 22-23, 2011 | 98 | 2011 |
| Damascene process for carbon memory element with MIIM diode AD Schricker, DC Sekar, A Fu, M Clark US Patent 7,615,439, 2009 | 95 | 2009 |
| Semiconductor device and structure Z Or-Bach, DC Sekar US Patent 8,026,521, 2011 | 89 | 2011 |
| 3D semiconductor device and structure with back-bias Z Or-Bach, DC Sekar, B Cronquist, I Beinglass, Z Wurman, P Lim US Patent 9,136,153, 2015 | 88 | 2015 |
Nima MokhlesiDevice physicist, SunRise Memory在 sunrise3d.com 的电子邮件经过验证
