| Mechanical properties and rolling behaviors of nano-grained copper with embedded nano-twin bundles Y Zhang, NR Tao, K Lu Acta Materialia 56 (11), 2429-2440, 2008 | 292 | 2008 |
| Effect of the Zener–Hollomon parameter on the microstructures and mechanical properties of Cu subjected to plastic deformation YS Li, Y Zhang, NR Tao, K Lu Acta Materialia 57 (3), 761-772, 2009 | 267 | 2009 |
| Effect of stacking-fault energy on deformation twin thickness in Cu–Al alloys Y Zhang, NR Tao, K Lu Scripta Materialia 60 (4), 211-213, 2009 | 206 | 2009 |
| Effects of stacking fault energy, strain rate and temperature on microstructure and strength of nanostructured Cu–Al alloys subjected to plastic deformation Y Zhang, NR Tao, K Lu Acta Materialia 59 (15), 6048-6058, 2011 | 159 | 2011 |
| Effect of thermal annealing on mechanical properties of a nanostructured copper prepared by means of dynamic plastic deformation YS Li, Y Zhang, NR Tao, K Lu Scripta Materialia 59 (4), 475-478, 2008 | 158 | 2008 |
| A high‐capacitance salt‐free dielectric for self‐healable, printable, and flexible organic field effect transistors and chemical sensor W Huang, K Besar, Y Zhang, S Yang, G Wiedman, Y Liu, W Guo, J Song, ... Advanced functional materials 25 (24), 3745-3755, 2015 | 114 | 2015 |
| Electrochemical corrosion characteristics and biocompatibility of nanostructured titanium for implants J Lu, Y Zhang, W Huo, W Zhang, Y Zhao, Y Zhang Applied Surface Science 434, 63-72, 2018 | 93 | 2018 |
| High strength and high electrical conductivity in bulk nanograined Cu embedded with nanoscale twins Y Zhang, YS Li, NR Tao, K Lu Applied Physics Letters 91 (21), 2007 | 76 | 2007 |
| Permeability measurements and modeling of topology-optimized metallic 3-D woven lattices L Zhao, S Ha, KW Sharp, AB Geltmacher, RW Fonda, AH Kinsey, Y Zhang, ... Acta Materialia 81, 326-336, 2014 | 51 | 2014 |
| Stress-driven grain growth in ultrafine grained Mg thin film Y Zhang, JA Sharon, GL Hu, KT Ramesh, KJ Hemker Scripta Materialia 68 (6), 424-427, 2013 | 43 | 2013 |
| Fabrication and mechanical characterization of 3D woven Cu lattice materials Y Zhang, S Ha, K Sharp, JK Guest, TP Weihs, KJ Hemker Materials & Design 85, 743-751, 2015 | 38 | 2015 |
| Development of Ni-based superalloys for microelectromechanical systems DE Burns, Y Zhang, M Teutsch, K Bade, J Aktaa, KJ Hemker Scripta Materialia 67 (5), 459-462, 2012 | 34 | 2012 |
| Discerning size effect strengthening in ultrafine-grained Mg thin films JA Sharon, Y Zhang, F Mompiou, M Legros, KJ Hemker Scripta Materialia 75, 10-13, 2014 | 33 | 2014 |
| Nano-twinning in a γ′ precipitate strengthened Ni-based superalloy SY Yuan, ZH Jiang, JZ Liu, Y Tang, Y Zhang Materials Research Letters 6 (12), 683-688, 2018 | 27 | 2018 |
| In situ TEM observations of high-strain-rate deformation and fracture in pure copper T Voisin, MD Grapes, TT Li, MK Santala, Y Zhang, JP Ligda, NJ Lorenzo, ... Materials Today 33, 10-16, 2020 | 25 | 2020 |
| Simultaneously improving the tensile strength and ductility of the AlNp/Al composites by the particle's hierarchical structure with bimodal distribution and nano-network F Lu, J Nie, X Ma, Y Li, Z Jiang, Y Zhang, Y Zhao, X Liu Materials Science and Engineering: A 770, 138519, 2020 | 24 | 2020 |
| Properties of sputter deposited Ni-base superalloys for microelectromechanical systems DE Burns, Y Zhang, TP Weihs, KJ Hemker Thin Solid Films 558, 20-23, 2014 | 16 | 2014 |
| Heterogeneous structure controlled by shear bands in partially recrystallized nano-laminated copper Y Jiang, RC Gu, Y Zhang, JT Wang Materials Science and Engineering: A 721, 226-233, 2018 | 11 | 2018 |
| The plausibility of< c+ a> dislocation slip on {-12-11} planes in Mg J Zhang, Y Zhang, JA El-Awady, Y Tang Scripta Materialia 156, 19-22, 2018 | 10 | 2018 |
| TEM sample preparation by femtosecond laser machining and ion milling for high-rate TEM straining experiments T Voisin, MD Grapes, Y Zhang, N Lorenzo, J Ligda, B Schuster, TP Weihs Ultramicroscopy 175, 1-8, 2017 | 9 | 2017 |
