| Embroidering electrical interconnects with conductive yarn for the integration of flexible electronic modules into fabric T Linz, C Kallmayer, R Aschenbrenner, H Reichl Ninth IEEE International Symposium on Wearable Computers (ISWC'05), 86-89, 2005 | 192 | 2005 |
| The agenda of wearable healthcare G Tröster Yearbook of medical informatics 14 (01), 125-138, 2005 | 170 | 2005 |
| Fully untegrated EKG shirt based on embroidered electrical interconnections with conductive yarn and miniaturized flexible electronics T Linz, C Kallmayer, R Aschenbrenner, H Reichl International workshop on wearable and implantable body sensor networks (BSN …, 2006 | 109 | 2006 |
| Embroidered interconnections and encapsulation for electronics in textiles for wearable electronics applications T Linz, R Vieroth, C Dils, M Koch, T Braun, KF Becker, C Kallmayer, ... Advances in science and technology 60, 85-94, 2009 | 107 | 2009 |
| Investigations of Au-Sn alloys on different end-metallizations for high temperature applications [solders] S Anhock, H Oppermann, C Kallmayer, R Aschenbrenner, L Thomas, ... Twenty Second IEEE/CPMT International Electronics Manufacturing Technology …, 1998 | 65 | 1998 |
| Improving the washability of smart textiles: Influence of different washing conditions on textile integrated conductor tracks S Rotzler, C Kallmayer, C Dils, M von Krshiwoblozki, U Bauer, ... The Journal of The Textile Institute 111 (12), 1766-1777, 2020 | 57 | 2020 |
| New assembly technologies for textile transponder systems C Kallmayer, R Pisarek, S Cichos, A Neudeck, S Gimpel Electronic Components and Technology Conference, 1123-1126, 2003 | 56 | 2003 |
| Stretchable circuit board technology and application R Vieroth, T Loher, M Seckel, C Dils, C Kallmayer, A Ostmann, H Reichl 2009 International Symposium on Wearable Computers, 33-36, 2009 | 47 | 2009 |
| Electronics in textiles–adhesive bonding technology for reliably embedding electronic modules into textile circuits M von Krshiwoblozki, T Linz, A Neudeck, C Kallmayer Advances in Science and Technology 85, 1-10, 2013 | 37 | 2013 |
| Large area sensor integration in textiles C Kallmayer, E Simon International Multi-Conference on Systems, Signals & Devices, 1-5, 2012 | 34 | 2012 |
| A new approach to chip size package using meniscus soldering and FPC-bonding C Kallmayer, E Jung, P Kasulke, R Azadeh, G Azdasht, E Zakel, H Reichl IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1998 | 32 | 1998 |
| Self-aligning flip-chip assembly using eutectic gold/tin solder in different atmospheres C Kallmayer, H Oppermann, G Eugelmann, E Zakel, H Reichl Nineteenth IEEE/CPMT International Electronics Manufacturing Technology …, 1996 | 31 | 1996 |
| Experimental results on the self-alignment process using Au/Sn metallurgy and the growth of the xi-phase during the reflow C Kallmayer, H Oppermann, J Kloeser, E Zakel, H Reichl | 30 | 1995 |
| Fluxless flip-chip attachment techniques using the Au/Sn metallurgy C Kallmayer, D Lin, J Kloeser, H Oppermann, E Zakel, H Reichl Seventeenth IEEE/CPMT International Electronics Manufacturing Technology …, 1995 | 26 | 1995 |
| Stretchable electronic systems: Realization and applications T Löher, M Seckel, R Vieroth, C Dils, C Kallmayer, A Ostmann, ... 2009 11th Electronics Packaging Technology Conference, 893-898, 2009 | 24 | 2009 |
| Development of a multi-terminal crimp package for smart textile integration EP Simon, C Kallmayer, M Schneider-Ramelow, KD Lang 2012 4th Electronic System-Integration Technology Conference, 1-6, 2012 | 22 | 2012 |
| Novel approach for integrating electronics into textiles at room temperature using a force-fit interconnection EP Simon, C Kallmayer, R Aschenbrenner, KD Lang 18th European Microelectronics & Packaging Conference, 1-7, 2011 | 22 | 2011 |
| New interconnection technologies for the integration of electronics on textile substrates T Linz, C Kallmayer, R Aschenbrenner, H Reichl Ambience 2005, 2005 | 21 | 2005 |
| Long time reliability study of soldered flip chips on flexible substrates B Pahl, C Kallmayer, R Aschenbrenner, H Reichl Microelectronics Reliability 44 (2), 309-314, 2004 | 21 | 2004 |
| Ultrathin assemblies on flexible substrates B Pahl, C Kallmayer, R Aschenbrenner, H Reichl 2005 7th Electronic Packaging Technology Conference 2, 6 pp., 2005 | 17 | 2005 |
