The effects of aging on the cyclic stress-strain behavior and hysteresis loop evolution of lead free solders M Mustafa, Z Cai, JC Suhling, P Lall 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 927-939, 2011 | 127 | 2011 |
Correlation of reliability models including aging effects with thermal cycling reliability data M Motalab, M Mustafa, JC Suhling, J Zhang, J Evans, MJ Bozack, P Lall 2013 IEEE 63rd Electronic Components and Technology Conference, 986-1004, 2013 | 125 | 2013 |
Characterization of aging effects in lead free solder joints using nanoindentation M Hasnine, M Mustafa, JC Suhling, BC Prorok, MJ Bozack, P Lall 2013 IEEE 63rd Electronic Components and Technology Conference, 166-178, 2013 | 112 | 2013 |
Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging M Mustafa, JC Suhling, P Lall Microelectronics Reliability 56, 136-147, 2016 | 84 | 2016 |
The effects of aging on the fatigue life of lead free solders M Mustafa, JC Roberts, JC Suhling, P Lall 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 666-683, 2014 | 83 | 2014 |
Evolution of the tension/compression and shear cyclic stress-strain behavior of lead-free solder subjected to isothermal aging M Mustafa, Z Cai, JC Roberts, JC Suhling, P Lall 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 64 | 2012 |
Thermal cycling reliability predictions for PBGA assemblies that include aging effects M Motalab, M Mustafa, JC Suhling, J Zhang, J Evans, MJ Bozack, P Lall International Electronic Packaging Technical Conference and Exhibition 55751 …, 2013 | 20 | 2013 |
Aging induced evolution of the cyclic stress-strain behavior of lead free solders N Fu, JC Suhling, M Mustafa, P Lall 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 13 | 2016 |
A numerical model of an oscillating squeeze film between a rubber surface and a rigid surface M Mustafa, NJ Chhanda, MM Razzaque Tribology international 43 (1-2), 202-209, 2010 | 12 | 2010 |
The effects of aging of the cyclic stress-strain and fatigue behaviors of lead free solders M Mustafa, JC Roberts, JC Suhling, P Lall International Electronic Packaging Technical Conference and Exhibition 55751 …, 2013 | 7 | 2013 |
Optimum geometry of MEMS heat exchanger for heat transfer enhancement NJ Chhanda, M Mustafa, MA Nur ARPN Journal of Engineering and Applied Sciences 5 (5), 11-20, 2010 | 6 | 2010 |
Nanomechanical characterization of lead free solder joints M Hasnine, M Mustafa, JC Suhling, BC Prorok, MJ Bozack, P Lall MEMS and Nanotechnology, Volume 5: Proceedings of the 2013 Annual Conference …, 2014 | 5 | 2014 |
Improved predictions of cyclic stress-strain curves for lead free solders using the Anand viscoplastic constitutive model M Motalab, M Mustafa, JC Suhling, P Lall 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 4 | 2016 |
Effects of aging on the cyclic stress strain and fatigue behaviors of lead-free solders M Mustafa Auburn University, 2014 | 4 | 2014 |
Parametric analysis of MEMS-based heat exchanger with different test fluids NJ Chhanda, M Mustafa, M Al Nur British Journal of Applied Science & Technology 3 (4), 925, 2013 | 4 | 2013 |
The influence of aging on the stress-strain and creep behavior of SAC solder alloys Y Zhang, Z Cai, M Mustafa, JC Suhling, P Lall, MJ Bozack 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010 | 4 | 2010 |
Effects of permeability and surface roughness on the behavior of an oscillating viscoelastic squeeze film M Mahbubur Razzaque, M Mustafa Industrial Lubrication and Tribology 65 (1), 37-43, 2013 | 3 | 2013 |
Effects of aging on shear cyclic stress strain and fatigue behaviors of lead free solder joints M Mustafa, JC Roberts, JC Suhling, P Lall Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 1 | 2014 |
A New Numerical Method for the Analysis of Stress Concentration in Tension Specimen M Mustafa, NJ Chhanda, MAS Akanda Journal of Experimental & Applied Mechanics 3 (1), 1-16, 2012 | 1 | 2012 |
Characterization of Hysteresis Loop Evolution in Aged Lead Free Solders M Mustafa, Z Cai, JC Suhling, P Lall International Electronic Packaging Technical Conference and Exhibition 44618 …, 2011 | 1 | 2011 |