受强制性开放获取政策约束的文章 - Jinzi Cui了解详情
可在其他位置公开访问的文章：1 篇
Interfacial reaction and microstructural evolution between Au-Ge solder and electroless Ni-WP metallization in high temperature electronics interconnects
L Liu, J Cui, J Wang, Z Zhou, RW Johnson, C Liu
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 417-422, 2017
强制性开放获取政策： UK Engineering and Physical Sciences Research Council
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