| Reliability of Ag sintering for power semiconductor die attach in high-temperature applications F Yu, J Cui, Z Zhou, K Fang, RW Johnson, MC Hamilton IEEE Transactions on Power Electronics 32 (9), 7083-7095, 2016 | 137 | 2016 |
| Investigation of thick film technology for high temperature applications Z Zhou, J Cui, F Yu, K Fang, Z Shen, RW Johnson, A Vert, T Zhang, ... Additional Papers and Presentations 2012 (HITEC), 000184-000191, 2012 | 9 | 2012 |
| Evaluation of thick-film materials for high-temperature packaging Z Zhou, J Cui, F Yu, RW Johnson, MC Hamilton IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (5 …, 2018 | 8 | 2018 |
| Reliability of AuGe die attach on DBC substrates with different Ni surface finishes J Cui, RW Johnson, MC Hamilton IEEE Transactions on Components, Packaging and Manufacturing Technology 7 …, 2017 | 4 | 2017 |
| Reliability of die attach on DBC substrates with different Ni surface finishes using BiAgX solder J Cui, RW Johnson, MC Hamilton IEEE Transactions on Components, Packaging and Manufacturing Technology 7 …, 2017 | 3 | 2017 |
| Materials for High Temperature Electronic Packaging J Cui Auburn University, 2016 | 1 | 2016 |
| Investigation into the Role of Different Substrate Ni Compositions and Plating Methods on Die Attach Reliability J Cui, RW Johnson, MC Hamilton Additional Papers and Presentations 2015 (HiTEN), 000073-000082, 2015 | 1 | 2015 |
| Interfacial reaction and microstructural evolution between Au-Ge solder and electroless Ni-WP metallization in high temperature electronics interconnects L Liu, J Cui, J Wang, Z Zhou, RW Johnson, C Liu 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 417-422, 2017 | | 2017 |
| Component Attachment with Pressureless Ag Sintering for 300° C Applications F Yu, J Cui, Z Zhou, RW Johnson, MC Hamilton Journal of Microelectronics and Electronic Packaging 13 (4), 155-162, 2016 | | 2016 |
| Component Attachment with Pressureless Sintering for 300° C Applications F Yu, J Cui, Z Zhou, RW Johnson, MC Hamilton Additional Papers and Presentations 2016 (HiTEC), 000226-000233, 2016 | | 2016 |
