| Experimental insights into thermal dissipation in TSV-based 3D integrated circuits P Coudrain, P Souare, JP Colonna, P Vivet, R Prieto, H Ben-Jamaa, ... IEEE Design & Test of Computers, 1-1, 2016 | 24 | 2016 |
| Using TSVs for thermal mitigation in 3D circuits: Wish and truth C Santos, PM Souare, F de Crecy, P Coudrain, JP Colonna, P Vivet, ... 2014 International 3D Systems Integration Conference (3DIC), 1-8, 2014 | 13 | 2014 |
| Thermal effects of silicon thickness in 3-D ICs: Measurements and simulations PM Souare, V Fiori, A Farcy, F de Crécy, HB Jamaa, A Borbely, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (8 …, 2014 | 13 | 2014 |
| Using confocal microscopy and digital image correlation to measure local strains around a chip corner and a crack front Y Yang, PM Souare, J Sylvestre IEEE Transactions on Device and Materials Reliability 20 (1), 97-105, 2019 | 9 | 2019 |
| CFD-based iterative methodology for modeling natural convection in microelectronic packages MK Toure, PM Souare, S Allard, B Foisy, E Duchesne, J Sylvestre 2018 19th International Conference on Thermal, Mechanical and Multi-Physics …, 2018 | 9 | 2018 |
| Study of capillary underfill filler separation in advanced flip chip packages MC Paquet, D Danovitch, PM Souare, J Sylvestre 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1361-1368, 2017 | 7 | 2017 |
| Thermal behavior of stack-based 3D ICs PM Souare, F de Crecy, V Fiori, HB Jamaa, A Farcy, S Gallois-Garreignot, ... 2012 4th electronic system-Integration technology conference, 1-6, 2012 | 7 | 2012 |
| Study of underfill corner cracks by the confocal-DIC and phantom-nodes methods Y Yang, MK Toure, PM Souare, E Duchesne, J Sylvestre Microelectronics Reliability 128, 114431, 2022 | 6 | 2022 |
| Best practices for thermal modeling in microelectronics with natural convection cooling: Sensitivity analysis MK Touré, PM Souaré, J Sylvestre | 6 | 2021 |
| Modeling of flip-chip underfill delamination and cracking with five input manufacturing variables Y Yang, MK Toure, PM Souare, E Duchesne, J Sylvestre Microelectronics Reliability 132, 114533, 2022 | 5 | 2022 |
| A mechanistic study of underfill cracks by the Confocal-DIC method Y Yang, F Habib, PM Souare, E Duchesne, J Sylvestre 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1087-1093, 2020 | 5 | 2020 |
| A comprehensive platform for thermal studies in TSV-based 3D integrated circuits PM Souare, P Coudrain, JP Colonna, V Fiori, A Farcy, F De Crécy, ... 2014 IEEE International Electron Devices Meeting, 35.4. 1-35.4. 4, 2014 | 5 | 2014 |
| Thermal correlation between measurements and FEM simulations in 3D ICs PM Souare, F de Crecy, V Fiori, HB Jamaa, A Farcy, S Gallois-Garreignot, ... 2013 IEEE International 3D Systems Integration Conference (3DIC), 1-6, 2013 | 5 | 2013 |
| Direct measurements of underfill local strain using confocal microscopy and digital image correlation Y Yang, PM Souare, J Sylvestre 2019 20th International Conference on Thermal, Mechanical and Multi-Physics …, 2019 | 4 | 2019 |
| High precision numerical and experimental thermal studies of microelectronic packages in still air chamber tests PM Souare, MK Toure, S Allard, B Foisy, B Borzou, E Duchesne, ... 2018 7th Electronic System-Integration Technology Conference (ESTC), 1-8, 2018 | 4 | 2018 |
| Cooling Heat Sinks by Natural and Forced Convection in Microelectronic Packages: Numerical Modeling and Experimental Thermal Studies PM Souare, MK Toure, B Foisy, E Duchesne, J Sylvestre 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 3 | 2020 |
| Thermal and mechanical analysis of a concentrated photovoltaic module with integrated secondary optics PM Souare, J Sylvestre AIP Conference Proceedings 1766 (1), 2016 | 3 | 2016 |
| Accurate modeling of forced convection cooling for microelectronic packages: Numerical and experimental thermal studies MK Toure, PM Souare, B Foisy, E Duchesne, J Sylvestre 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 2 | 2019 |
| Experimental Identification of the Failure Modes and Failure Mechanisms of Fiber to Waveguide Couplings Under Cyclic Tensile Loading D Assane, M Jean-François, SP Momar, JP Alexander, S Julien 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 324-330, 2023 | | 2023 |
| Applied Modeling Framework in Integrated Circuit Design and Reliability PM Souare, C Bouchard, E Duchesne, J Zaccardi, D Pettit, F Vachon 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 204-210, 2022 | | 2022 |
