受强制性开放获取政策约束的文章 - Papa Momar Souare了解详情
无法在其他位置公开访问的文章：11 篇
CFD-based iterative methodology for modeling natural convection in microelectronic packages
MK Toure, PM Souare, S Allard, B Foisy, E Duchesne, J Sylvestre
2018 19th International Conference on Thermal, Mechanical and Multi-Physics …, 2018
强制性开放获取政策： Natural Sciences and Engineering Research Council of Canada
Study of capillary underfill filler separation in advanced flip chip packages
MC Paquet, D Danovitch, PM Souare, J Sylvestre
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1361-1368, 2017
强制性开放获取政策： Natural Sciences and Engineering Research Council of Canada
Study of underfill corner cracks by the confocal-DIC and phantom-nodes methods
Y Yang, MK Toure, PM Souare, E Duchesne, J Sylvestre
Microelectronics Reliability 128, 114431, 2022
强制性开放获取政策： Natural Sciences and Engineering Research Council of Canada
Modeling of flip-chip underfill delamination and cracking with five input manufacturing variables
Y Yang, MK Toure, PM Souare, E Duchesne, J Sylvestre
Microelectronics Reliability 132, 114533, 2022
强制性开放获取政策： Natural Sciences and Engineering Research Council of Canada
A mechanistic study of underfill cracks by the Confocal-DIC method
Y Yang, F Habib, PM Souare, E Duchesne, J Sylvestre
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1087-1093, 2020
强制性开放获取政策： Natural Sciences and Engineering Research Council of Canada
High precision numerical and experimental thermal studies of microelectronic packages in still air chamber tests
PM Souare, MK Toure, S Allard, B Foisy, B Borzou, E Duchesne, ...
2018 7th Electronic System-Integration Technology Conference (ESTC), 1-8, 2018
强制性开放获取政策： Natural Sciences and Engineering Research Council of Canada
Direct measurements of underfill local strain using confocal microscopy and digital image correlation
Y Yang, PM Souare, J Sylvestre
2019 20th International Conference on Thermal, Mechanical and Multi-Physics …, 2019
强制性开放获取政策： Natural Sciences and Engineering Research Council of Canada
Cooling Heat Sinks by Natural and Forced Convection in Microelectronic Packages: Numerical Modeling and Experimental Thermal Studies
PM Souare, MK Toure, B Foisy, E Duchesne, J Sylvestre
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020
强制性开放获取政策： Natural Sciences and Engineering Research Council of Canada
Accurate modeling of forced convection cooling for microelectronic packages: Numerical and experimental thermal studies
MK Toure, PM Souare, B Foisy, E Duchesne, J Sylvestre
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019
强制性开放获取政策： Natural Sciences and Engineering Research Council of Canada
Experimental Identification of the Failure Modes and Failure Mechanisms of Fiber to Waveguide Couplings Under Cyclic Tensile Loading
D Assane, M Jean-François, SP Momar, JP Alexander, S Julien
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 324-330, 2023
强制性开放获取政策： Natural Sciences and Engineering Research Council of Canada
Bond At The End: A Comprehensive Study of a New High-Throughput Bonding Process
SB Jemaa, P Gagnon, A Dione, MK Touré, JF Morissette, PM Souare, ...
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 194-200, 2020
强制性开放获取政策： Natural Sciences and Engineering Research Council of Canada
可在其他位置公开访问的文章：3 篇
Using confocal microscopy and digital image correlation to measure local strains around a chip corner and a crack front
Y Yang, PM Souare, J Sylvestre
IEEE Transactions on Device and Materials Reliability 20 (1), 97-105, 2019
强制性开放获取政策： Natural Sciences and Engineering Research Council of Canada
Best practices for thermal modeling in microelectronics with natural convection cooling: Sensitivity analysis
MK Touré, PM Souaré, J Sylvestre
强制性开放获取政策： Natural Sciences and Engineering Research Council of Canada
Thermal and mechanical analysis of a concentrated photovoltaic module with integrated secondary optics
PM Souare, J Sylvestre
AIP Conference Proceedings 1766 (1), 2016
强制性开放获取政策： Natural Sciences and Engineering Research Council of Canada
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