| Sensitivity of 2DEG-based Hall-effect sensors at high temperatures HS Alpert, CA Chapin, KM Dowling, SR Benbrook, H Köck, ... Review of Scientific Instruments 91 (2), 2020 | 35 | 2020 |
| ANSYS based 3D electro-thermal simulations for the evaluation of power MOSFETs robustness S De Filippis, V Košel, D Dibra, S Decker, H Köck, A Irace Microelectronics Reliability 51 (9-11), 1954-1958, 2011 | 35 | 2011 |
| Effect of geometry on sensitivity and offset of AlGaN/GaN and InAlN/GaN Hall-effect sensors HS Alpert, KM Dowling, CA Chapin, AS Yalamarthy, SR Benbrook, ... IEEE Sensors Journal 19 (10), 3640-3646, 2019 | 30 | 2019 |
| A new cycle test system emulating inductive switching waveforms M Glavanovics, H Kock, H Eder, V Kosel, T Smorodin 2007 European Conference on Power Electronics and Applications, 1-9, 2007 | 26 | 2007 |
| IR thermography and FEM simulation analysis of on-chip temperature during thermal-cycling power-metal reliability testing using in situ heated structures H Köck, V Košel, C Djelassi, M Glavanovics, D Pogany Microelectronics Reliability 49 (9-11), 1132-1136, 2009 | 20 | 2009 |
| Micro-tesla offset in thermally stable AlGaN/GaN 2DEG Hall plates using current spinning KM Dowling, HS Alpert, AS Yalamarthy, PF Satterthwaite, S Kumar, ... IEEE Sensors Letters 3 (3), 1-4, 2019 | 18 | 2019 |
| Modeling of highly anisotropic microstructures for electro-thermal simulations of power semiconductor devices S de Filippis, H Köck, M Nelhiebel, V Košel, S Decker, M Glavanovics, ... Microelectronics Reliability 52 (9-10), 2374-2379, 2012 | 17 | 2012 |
| Flexible active cycle stress testing of smart power switches M Glavanovics, H Köck, V Košel, T Smorodin Microelectronics Reliability 47 (9-11), 1790-1794, 2007 | 15 | 2007 |
| Low offset and noise in high biased GaN 2DEG Hall-effect plates investigated with infrared microscopy KM Dowling, T Liu, HS Alpert, CA Chapin, SR Eisner, AS Yalamarthy, ... Journal of Microelectromechanical Systems 29 (5), 669-676, 2020 | 14 | 2020 |
| Bias magnetic field sensor T Werth, R Hermann, U Ausserlechner, H Koeck, F Heinrichs US Patent 10,338,158, 2019 | 12 | 2019 |
| Linear position magnetic field sensor with differential sensing and a differential magnetic field sensing method A Satz, H Koeck, D Hammerschmidt, G Binder US Patent App. 15/623,659, 2018 | 12 | 2018 |
| Electrothermal multiscale modeling and simulation concepts for power electronics H Köck, S Eiser, M Kaltenbacher IEEE Transactions on Power Electronics 31 (4), 3128-3140, 2015 | 12 | 2015 |
| Emerging GaN-based HEMTs for mechanical sensing within harsh environments H Köck, CA Chapin, C Ostermaier, O Häberlen, DG Senesky Sensors for Extreme Harsh Environments 9113, 69-76, 2014 | 12 | 2014 |
| The effect of bias conditions on AlGaN/GaN 2DEG Hall plates KM Dowling, HS Alpert, P Zhang, AN Ramirez, A Yalamathy, H Kock, ... Solid State Sensors, Actuators, and Microsystems Workshop, 194-197, 2018 | 11 | 2018 |
| Redudant magnetic field sensor arrangement for error detection and method for detecting errors while measuring an external magnetic field using redundant sensing D Hammerschmidt, H Koeck, A Monterastelli, T Werth US Patent 11,320,497, 2022 | 9 | 2022 |
| Macroscopic simulation of isotropic permanent magnets F Bruckner, C Abert, C Vogler, F Heinrichs, A Satz, U Ausserlechner, ... Journal of Magnetism and Magnetic Materials 401, 875-879, 2016 | 9 | 2016 |
| Improved thermal management of low voltage power devices with optimized bond wire positions H Köck, C Djelassi, S de Filippis, R Illing, M Nelhiebel, M Ladurner, ... Microelectronics Reliability 51 (9-11), 1913-1918, 2011 | 9 | 2011 |
| Angle based speed sensor device H Koeck, L Aichriedler, D Hammerschmidt, A Monterastelli, F Rasbornig, ... US Patent 11,125,768, 2021 | 8 | 2021 |
| Auto focus and image registration techniques for infrared imaging of microelectronic devices D Florian, H Koeck, K Plankensteiner, M Glavanovics Measurement Science and Technology 24 (7), 074020, 2013 | 7 | 2013 |
| Validated electro-thermal simulations of two different power mosfet technologies and implications on their robustness S de Filippis, R Illing, M Nelhiebel, S Decker, H Köck, A Irace 2013 25th International Symposium on Power Semiconductor Devices & IC's …, 2013 | 6 | 2013 |
Michael GlavanovicsKAI Kompetenzzentrum Automobil- und Industrieelektronik在 k-ai.at 的电子邮件经过验证
Michael GlavanovicsKAI Kompetenzzentrum Automobil- und Industrieelektronik在 k-ai.at 的电子邮件经过验证
Gregor PobegenSenior staff engineer, KAI GmbH, Austria在 k-ai.at 的电子邮件经过验证