A 3D-IC technology with integrated microchannel cooling D Sekar, C King, B Dang, T Spencer, H Thacker, P Joseph, M Bakir, ... 2008 International Interconnect Technology Conference, 13-15, 2008 | 388 | 2008 |
25Gb/s 1V-driving CMOS ring modulator with integrated thermal tuning G Li, X Zheng, J Yao, H Thacker, I Shubin, Y Luo, K Raj, JE Cunningham, ... Optics Express 19 (21), 20435-20443, 2011 | 275 | 2011 |
Ring resonator modulators in silicon for interchip photonic links G Li, AV Krishnamoorthy, I Shubin, J Yao, Y Luo, H Thacker, X Zheng, ... IEEE Journal of Selected Topics in Quantum Electronics 19 (6), 95-113, 2013 | 222 | 2013 |
Ultralow-loss, high-density SOI optical waveguide routing for macrochip interconnects G Li, J Yao, H Thacker, A Mekis, X Zheng, I Shubin, Y Luo, JH Lee, K Raj, ... Optics express 20 (11), 12035-12039, 2012 | 210 | 2012 |
Exploiting CMOS manufacturing to reduce tuning requirements for resonant optical devices AV Krishnamoorthy, X Zheng, G Li, J Yao, T Pinguet, A Mekis, H Thacker, ... IEEE Photonics Journal 3 (3), 567-579, 2011 | 191 | 2011 |
Ultra-efficient 10Gb/s hybrid integrated silicon photonic transmitter and receiver X Zheng, D Patil, J Lexau, F Liu, G Li, H Thacker, Y Luo, I Shubin, J Li, ... Optics Express 19 (6), 5172-5186, 2011 | 181 | 2011 |
Highly-efficient thermally-tuned resonant optical filters JE Cunningham, I Shubin, X Zheng, T Pinguet, A Mekis, Y Luo, H Thacker, ... Optics express 18 (18), 19055-19063, 2010 | 176 | 2010 |
3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation MS Bakir, C King, D Sekar, H Thacker, B Dang, G Huang, A Naeemi, ... 2008 IEEE Custom Integrated Circuits Conference, 663-670, 2008 | 136 | 2008 |
A tunable 1x4 silicon CMOS photonic wavelength multiplexer/demultiplexer for dense optical interconnects X Zheng, I Shubin, G Li, T Pinguet, A Mekis, J Yao, H Thacker, Y Luo, ... Optics express 18 (5), 5151-5160, 2010 | 123 | 2010 |
A high-speed, tunable silicon photonic ring modulator integrated with ultra-efficient active wavelength control X Zheng, E Chang, P Amberg, I Shubin, J Lexau, F Liu, H Thacker, ... Optics express 22 (10), 12628-12633, 2014 | 119 | 2014 |
Ultra-low-energy all-CMOS modulator integrated with driver X Zheng, J Lexau, Y Luo, H Thacker, T Pinguet, A Mekis, G Li, J Shi, ... Optics Express 18 (3), 3059-3070, 2010 | 104 | 2010 |
Ultralow power 80 Gb/s arrayed CMOS silicon photonic transceivers for WDM optical links X Zheng, F Liu, J Lexau, D Patil, G Li, Y Luo, HD Thacker, I Shubin, J Yao, ... Journal of Lightwave Technology 30 (4), 641-650, 2011 | 92 | 2011 |
Sea of Leads (SoL) ultrahigh density wafer-level chip input/output interconnections for gigascale integration (GSI) MS Bakir, HA Reed, HD Thacker, CS Patel, PA Kohl, KP Martin, JD Meindl IEEE Transactions on Electron Devices 50 (10), 2039-2048, 2003 | 86 | 2003 |
From chip to cloud: Optical interconnects in engineered systems AV Krishnamoorthy, HD Thacker, O Torudbakken, S Müller, A Srinivasan, ... Journal of Lightwave Technology 35 (15), 3103-3115, 2017 | 84 | 2017 |
High power and widely tunable Si hybrid external-cavity laser for power efficient Si photonics WDM links JH Lee, I Shubin, J Yao, J Bickford, Y Luo, S Lin, SS Djordjevic, ... Optics express 22 (7), 7678-7685, 2014 | 84 | 2014 |
Efficient WDM laser sources towards terabyte/s silicon photonic interconnects X Zheng, S Lin, Y Luo, J Yao, G Li, SS Djordjevic, JH Lee, HD Thacker, ... Journal of Lightwave Technology 31 (24), 4142-4154, 2013 | 84 | 2013 |
Hybrid-integrated photonic chip package with an interposer HD Thacker, AV Krishnamoorthy, IIRD Hopkins, J Lexau, X Zheng, R Ho, ... US Patent 9,297,971, 2016 | 83 | 2016 |
Improving CMOS-compatible Germanium photodetectors G Li, Y Luo, X Zheng, G Masini, A Mekis, S Sahni, H Thacker, J Yao, ... Optics express 20 (24), 26345-26350, 2012 | 81 | 2012 |
A sub-picojoule-per-bit CMOS photonic receiver for densely integrated systems X Zheng, F Liu, D Patil, H Thacker, Y Luo, T Pinguet, A Mekis, J Yao, G Li, ... Optics Express 18 (1), 204-211, 2010 | 72 | 2010 |
Maintaining alignment in a multi-chip module using a compressible structure HD Thacker, HS Yang, I Shubin, JE Cunningham US Patent 8,742,576, 2014 | 70 | 2014 |