A High Efficiency Input/Output Magnetically Coupled Interleaved Buck–Boost Converter With Low Internal Oscillation for Fuel-Cell Applications: CCM Steady-State Analysis V Samavatian, A Radan industrial Electronics, IEEE Transactions on 69 (9), 5560-5568, 2015 | 87 | 2015 |
A high efficiency input/output magnetically coupled interleaved buck–boost converter with low internal oscillation for fuel-cell applications: Small signal modeling and dynamic … V Samavatian, A Radan International Journal of Electrical Power & Energy Systems 67, 261-271, 2015 | 87 | 2015 |
A Novel Non-isolated Ultra-high Voltage Gain DC-DC Converter with low voltage stress Y Cao, V Samavatian, K Kaskani, H Eshraghi IEEE Transactions on Industrial Electronics 64 (4), 2809 - 2819, 2017 | 65 | 2017 |
Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics V Samavatian, M Fotuhi-Firuzabad, M Samavatian, P Dehghanian, ... Scientific reports 10 (1), 14821, 2020 | 63 | 2020 |
An efficient online time-temperature-dependent creep-fatigue rainflow counting algorithm V Samavatian, H Iman-Eini, Y Avenas International Journal of fatigue 116, 284-292, 2018 | 56 | 2018 |
Effects of system design on fatigue life of solder joints in BGA packages under vibration at random frequencies M Samavatian, LK Ilyashenko, A Surendar, A Maseleno, V Samavatian Journal of Electronic Materials 47, 6781-6790, 2018 | 47 | 2018 |
A novel low-ripple interleaved buck–boost converter with high efficiency and low oscillation for fuel-cell applications V Samavatian, A Radan International Journal of Electrical Power & Energy Systems 63, 446-454, 2014 | 47 | 2014 |
Effects of Creep Failure Mechanisms on Thermo-mechanical Reliability of Solder Joints in Power Semiconductors V Samavatian, H Iman-Eini, Y Avenas, M Samavatian IEEE Transactions on Power Electronics 35 (9), 8956 - 8964, 2020 | 44 | 2020 |
Effect of solder layer thickness on thermo-mechanical reliability of a power electronic system A Surendar, V Samavatian, A Maseleno, AZ Ibatova, M Samavatian Journal of Materials Science: Materials in Electronics 29, 15249-15258, 2018 | 44 | 2018 |
Discovery of novel quaternary bulk metallic glasses using a developed correlation-based neural network approach M Samavatian, R Gholamipour, V Samavatian Computational Materials Science 186, 110025, 2021 | 43 | 2021 |
Effect of stress triaxiality on damage evolution of porous solder joints in IGBT Discretes M Samavatian, V Samavatian, M Moayeri, H Babaei Journal of Manufacturing Processes 32, 57-64, 2018 | 38 | 2018 |
Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module D Ghaderi, M Pourmahdavi, V Samavatian, O Mir, M Samavatian Proceedings of the Institution of Mechanical Engineers, Part L: Journal of …, 2019 | 31 | 2019 |
Reliability Enhancement of a power semiconductor with optimized solder layer thickness R Elakkiya, G Kavithaa, V Samavatian, K Alhaifi, A Kokabi, H Moayedi IEEE Transactions on Power Electronics 35 (6), 6397 - 6404, 2020 | 29 | 2020 |
Effect of thermal cycle loadings on mechanical properties and thermal conductivity of a porous lead-free solder joint A Surendar, LG Akhmetov, LK Ilyashenko, A Maseleno, V Samavatian IEEE Transactions on Components, Packaging and Manufacturing Technology 8 …, 2018 | 24 | 2018 |
Effects of thermo-mechanical fatigue and low cycle fatigue interaction on performance of solder joints A Surendar, KH Kishore, M Kavitha, AZ Ibatova, V Samavatian IEEE Transactions on Device and Materials Reliability 18 (4), 606-612, 2018 | 23 | 2018 |
Effects of Nb minor addition on atomic structure and glass forming ability of Zr55Cu30Ni5Al10 bulk metallic glass M Samavatian, R Gholamipour, V Samavatian, F Farahani Materials Research Express 6 (6), 065202, 2019 | 22 | 2019 |
Reliability Assessment of Multistate Degraded Systems: An Application to Power Electronic Systems V Samavatian, H Imaneini, Y Avenas IEEE Transactions on Power Electronics 35 (4), 4024 - 4032, 2020 | 21 | 2020 |
Iterative machine learning-aided framework bridges between fatigue and creep damages in solder interconnections V Samavatian, M Fotuhi-Firuzabad, M Samavatian, P Dehghanian, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2021 | 20 | 2021 |
Influence of directional random vibration on the fatigue life of solder joints in a power module V Samavatian, A Masoumian, M Mafi, M Lakzaei, D Ghaderi IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (2 …, 2018 | 20 | 2018 |
Inherent relation between atomic-level stresses and nanoscale heterogeneity in Zr-based bulk metallic glass under a rejuvenation process M Samavatian, R Gholamipour, AA Amadeh, V Samavatian Physica B: Condensed Matter 595, 412390, 2020 | 17 | 2020 |