| Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys DR Frear, PT Vianco Metallurgical and Materials Transactions A 25, 1509-1523, 1994 | 336 | 1994 |
| Issues in the replacement of lead-bearing solders PT Vianco, DR Frear Jom 45, 14-19, 1993 | 293 | 1993 |
| Intermetallic compound layer formation between copper and hot-dipped 100In, 50In-50Sn, 100Sn, and 63Sn-37Pb coatings PT Vianco, PF Hlava, AC Kilgo Journal of electronic materials 23, 583-594, 1994 | 226 | 1994 |
| Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part I: experimental analysis PT Vianco, KL Erickson, PL Hopkins Journal of Electronic Materials 23, 721-727, 1994 | 184 | 1994 |
| Properties of ternary Sn-Ag-Bi solder alloys: Part I—Thermal properties and microstructural analysis PT Vianco, JA Rejent Journal of electronic materials 28, 1127-1137, 1999 | 167 | 1999 |
| Properties of ternary Sn-Ag-Bi solder alloys: Part II—Wettability and mechanical properties analyses PT Vianco, JA Rejent Journal of Electronic Materials 28, 1138-1143, 1999 | 159 | 1999 |
| Evaluation of lead-free solder joints in electronic assemblies I Artaki, AM Jackson, PT Vianco Journal of Electronic Materials 23, 757-764, 1994 | 117 | 1994 |
| Acceleration models, constitutive equations, and reliability of lead-free solders and joints J Lau, W Danksher, P Vianco 53rd Electronic Components and Technology Conference, 2003. Proceedings …, 2003 | 116 | 2003 |
| Solid-state intermetallic compound layer growth between copper and 95.5 Sn-3.9 Ag-0.6 Cu solder PT Vianco, JA Rejent, PF Hlava Journal of electronic materials 33, 991-1004, 2004 | 114 | 2004 |
| An overview of surface finishes and their role in printed circuit board solderability and solder joint performance PT Vianco Circuit World 25 (1), 6-24, 1999 | 110 | 1999 |
| Intermetallic compound layer growth by solid state reactions between 58Bi-42Sn solder and copper PT Vianco, AC Kilgo, R Grant Journal of Electronic Materials 24, 1493-1505, 1995 | 99 | 1995 |
| Time-independent mechanical and physical properties of the ternary 95.5 Sn-3.9 Ag-0.6 Cu solder PT Vianco, JA Rejent, AC Kilgo Journal of electronic materials 32, 142-151, 2003 | 94 | 2003 |
| Dynamic recrystallization (DRX) as the mechanism for Sn whisker development. Part I: A model PT Vianco, JA Rejent Journal of electronic materials 38, 1815-1825, 2009 | 77 | 2009 |
| Creep behavior of the ternary 95.5 Sn-3.9 Ag-0.6 Cu solder—Part I: As-cast condition PT Vianco, JA Rejent, AC Kilgo Journal of Electronic Materials 33, 1389-1400, 2004 | 74 | 2004 |
| Intermetallic compound layer development during the solid state thermal aging of 63Sn-37Pb solder/Au-Pt-Pd thick film couples PT Vianco, JJ Stephens, JA Rejent IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1997 | 72 | 1997 |
| Soldering handbook PT Vianco American Welding Society, 1999 | 65 | 1999 |
| Creep behavior of the ternary 95.5 Sn-3.9 Ag-0.6 Cu solder: Part II—Aged condition PT Vianco, JA Rejent, AC Kilgo Journal of Electronic Materials 33, 1473-1484, 2004 | 62 | 2004 |
| The compression stress-strain behavior of Sn-Ag-Cu solder PT Vianco, JA Rejent, JJ Martin Jom 55, 50-55, 2003 | 59 | 2003 |
| Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal mechanical fatigue PT Vianco, SN Burchett, MK Neilsen, JA Rejent, DR Frear Journal of Electronic Materials 28 (11), 1290-1298, 1999 | 55 | 1999 |
| Development of alternatives to lead-bearing solders PT Vianco Sandia National Labs., Albuquerque, NM (United States); National Center for …, 1993 | 50 | 1993 |
