受强制性开放获取政策约束的文章 - Paul Vianco了解详情
可在其他位置公开访问的文章：54 篇
A review of interface microstructures in electronic packaging applications: Soldering technology
PT Vianco
Jom 71 (1), 158-177, 2019
强制性开放获取政策： US Department of Energy
Validation of the dynamic recrystallization (DRX) mechanism for whisker and hillock growth on Sn thin films
PT Vianco, MK Neilsen, JA Rejent, RP Grant
Journal of Electronic Materials 44, 4012-4034, 2015
强制性开放获取政策： US Department of Energy
THERMAL MECHANICAL FATIGUE OF A 56 I/O PLASTIC QUAD-FLAT NOLEAD (PQFN) PACKAGE.
PT Vianco, MK Neilsen
Sandia National Lab.(SNL-NM), Albuquerque, NM (United States); Sandia …, 2015
强制性开放获取政策： US Department of Energy
Understanding the reliability of solder joints used in advanced structural and electronics applications: Part 1-Filler metal properties and the soldering process
PT Vianco
Welding Journal 96 (SAND-2017-1069J), 2017
强制性开放获取政策： US Department of Energy
Mitigation of long whisker growth based upon the dynamic recrystallization mechanism
PT Vianco, DP Cummings, PG Kotula, BM McKenzie, LM Lowery, ...
Journal of Electronic Materials 49, 888-904, 2020
强制性开放获取政策： US Department of Energy
Understanding the Reliability of Solder Joints Used in Advanced Structural and Electronics Applications: Part 2-Reliability Performance.
PT Vianco
Welding Journal 96 (SAND-2017-1070J), 2017
强制性开放获取政策： US Department of Energy
Interface reactions responsible for run-out in active brazing: Part 1
PT Vianco, CA Walker, DJ De Smet, AC Kilgo, BM McKenzie, RL Grant
Welding Journal 97 (SAND-2017-11635J), 2018
强制性开放获取政策： US Department of Energy
UCPD model for Pb-free solder
MK Neilsen, PT Vianco
Journal of electronic Packaging 136 (4), 041006, 2014
强制性开放获取政策： US Department of Energy
Understanding the Run-out Behavior of a Ag-Cu-Zr Braze Alloy When Used to Join Alumina to an Fe-Ni-Co Alloy.
PT Vianco, CA Walker, DJ De Smet, AC Kilgo, BB McKenzie, PG Kotula, ...
Sandia National Lab.(SNL-NM), Albuquerque, NM (United States), 2015
强制性开放获取政策： US Department of Energy
Processing and Reliability of Solder Interconnections in Stacked Packaging
P Vianco, M Neilsen
3D Microelectronic Packaging: From Architectures to Applications, 471-526, 2021
强制性开放获取政策： US Department of Energy
Thick Film Process Characterization for Thin Film Metallized LTCC
MA Girardi, KA Peterson, PT Vianco
Journal of Microelectronics and Electronic Packaging 13 (3), 136-142, 2016
强制性开放获取政策： US Department of Energy
Laser ablation of thin films on low temperature cofired ceramic
MA Girardi, KA Peterson, PT Vianco, R Grondin, D Wieliczka
Journal of Microelectronics and Electronic Packaging 12 (2), 72-79, 2015
强制性开放获取政策： US Department of Energy
Gold-Tin Solder Wetting Behavior for Package Lid Seals
PT Vianco, AC Kilgo, BM McKenzie
Journal of Electronic Packaging 140 (2), 021003, 2018
强制性开放获取政策： US Department of Energy
Laser ablation of thin films on LTCC
MA Girardi, KA Peterson, PT Vianco, R Grondin, D Wieliczka
International Symposium on Microelectronics 2014 (1), 000677-000686, 2014
强制性开放获取政策： US Department of Energy
Impact of Gold Thickness on Interfacial Evolution and Subsequent Embrittlement of Tin–Lead Solder Joints
R Wheeling, P Vianco, S Williams, L Jauregui, DFS Gallis
Journal of Electronic Materials 51 (12), 7337-7352, 2022
强制性开放获取政策： US Department of Energy
Computational Modeling Demonstrates the Joint Clearance Effect on the Tensile Strength of Solder Joints.
P Vianco, M Neilsen
Welding Journal 100 (SAND-2021-9149J), 2021
强制性开放获取政策： US Department of Energy
Time independent deformation of a Sn-Ag-Bi Pb-free solder: Stress–strain deformation and yield stress properties
PT Vianco, BB McKenzie, JA Rejent, JM Grazier, CE Jaramillo, AC Kilgo
Journal of Electronic Materials 49, 152-172, 2020
强制性开放获取政策： US Department of Energy
LTCC Thick Film Process Characterization
MA Girardi, KA Peterson, PT Vianco
Additional Papers and Presentations 2016 (CICMT), 000142-000150, 2016
强制性开放获取政策： US Department of Energy
Elastic Modulus and Coefficient of Thermal Expansion of 91.84 Sn-3.33 Ag-4.83 Bi Pb-Free Solder
PT Vianco, MK Neilsen, S Williams, DR Bradley, TW Diebold
Journal of Electronic Materials 52 (3), 2116-2138, 2023
强制性开放获取政策： US Department of Energy
Interface Embrittlement Between 63Sn-37Pb Solder and Au Layer—Part 1: Physical Metallurgy of Liquid-State and Solid-State Reactions
PT Vianco, AC Kilgo, BM McKenzie, RL Grant, S Williams
Journal of Electronic Materials 51 (11), 6431-6453, 2022
强制性开放获取政策： US Department of Energy
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