| TeraPHY: A chiplet technology for low-power, high-bandwidth in-package optical I/O M Wade, E Anderson, S Ardalan, P Bhargava, S Buchbinder, ... IEEE Micro 40 (2), 63-71, 2020 | 115 | 2020 |
| High thermal conductivity in electrostatically engineered amorphous polymers A Shanker, C Li, GH Kim, D Gidley, KP Pipe, J Kim Science advances 3 (7), e1700342, 2017 | 113 | 2017 |
| An error-free 1 Tbps WDM optical I/O chiplet and multi-wavelength multi-port laser M Wade, E Anderson, S Ardalan, W Bae, B Beheshtian, S Buchbinder, ... Optical Fiber Communication Conference, F3C. 6, 2021 | 72 | 2021 |
| Teraphy: An o-band wdm electro-optic platform for low power, terabit/s optical i/o C Sun, D Jeong, M Zhang, W Bae, C Zhang, P Bhargava, D Van Orden, ... 2020 IEEE Symposium on VLSI Technology, 1-2, 2020 | 31 | 2020 |
| Feedback-induced failure of high-power diode lasers PO Leisher, C Li, AK Jha, KP Pipe, JD Helmrich, P Thiagarajan, ... IEEE Journal of Quantum Electronics 54 (6), 1-13, 2018 | 17 | 2018 |
| 5.12 Tbps co-packaged FPGA and silicon photonics interconnect I/O K Hosseini, E Kok, SY Shumarayev, D Jeong, A Chan, A Katzin, S Liu, ... 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and …, 2022 | 12 | 2022 |
| Thermoreflectance imaging of back-irradiance heating in high power diode lasers at several operating wavelengths AK Jha, C Li, KP Pipe, MT Crowley, DB Fullager, JD Helmrich, ... IEEE Journal of Selected Topics in Quantum Electronics 25 (6), 1-13, 2019 | 11 | 2019 |
| Thermoreflectance-based measurement of facet optical absorption in high power diode lasers AK Jha, C Li, KP Pipe, MT Crowley, DB Fullager, JD Helmrich, ... IEEE Photonics Technology Letters 31 (24), 1909-1912, 2019 | 10 | 2019 |
| Thermal imaging of high power diode lasers subject to back-irradiance C Li, KP Pipe, C Cao, P Thiagarajan, RJ Deri, PO Leisher Applied Physics Letters 112 (10), 2018 | 10 | 2018 |
| Monolithic microring-based WDM optical I/O for heterogeneous computing M Wade, D Jeong, B Kim, M Zhang, W Bae, C Zhang, P Bhargava, ... 2021 Symposium on VLSI Circuits, 1-2, 2021 | 8 | 2021 |
| Root cause investigation of back-irradiance-induced failure of high power diode lasers PO Leisher, D Pope, L Platz, M Boisselle, M Runkel, RJ Deri, S Smith, ... 2017 IEEE High Power Diode Lasers and Systems Conference (HPD), 53-54, 2017 | 6 | 2017 |
| An uncooled CW-WDM MSA compliant multi-wavelength laser source operating from 15-100oC for WDM CMOS applications MN Sysak, R Roucka, S Liu, C Li, F Luna, J Frey, M Raval, C Zhang, ... Optical Interconnects XXII 12007, 141-143, 2022 | 4 | 2022 |
| Multi-Chip Packaging of Silicon Photonics CL Roy Meade, Chong Zhang, Haiwei Lu US Patent App. 17/070,601, 2021 | 3* | 2021 |
| Measurement of facet optical absorption in high power diode lasers using thermoreflectance AK Jha, C Li, KP Pipe, MT Crowley, DB Fullager, JD Helmrich, ... 2019 IEEE High Power Diode Lasers and Systems Conference (HPD), 25-26, 2019 | 3 | 2019 |
| CCD-based thermoreflectance imaging of high-power diode lasers with back-irradiance C Li, KP Pipe, C Cao, P Thiagarajan, RJ Deri, PO Leisher Laser Technology for Defense and Security XIV 10637, 54-61, 2018 | 3 | 2018 |
| Applications of thermoreflectance imaging to high-power diode laser diagnostics KP Pipe, AK Jha, C Li, MT Crowley, DB Fullager, JD Helmrich, ... 2019 IEEE High Power Diode Lasers and Systems Conference (HPD), 43-44, 2019 | 2 | 2019 |
| Multi-wavelength sources for Optical IO Co-packaged optics MN Sysak, R Roucka, N Aggarwal, C Li, F Luna, S El-Hemawy, J Frey, ... 2024 Optical Fiber Communications Conference and Exhibition (OFC), 1-3, 2024 | 1 | 2024 |
| High Wavelength Count Laser Sources for WDM CMOS Optical Interconnects M Sysak, R Roucka, M Raval, F Luna, S El-Henawy, J Frey, C Li, C Zhang, ... 2022 28th International Semiconductor Laser Conference (ISLC), 1-2, 2022 | 1 | 2022 |
| A Spinal Circuit That Transmits Innocuous Cool Sensations LR Horwitz, H Lee, CC Hor, FY Shen, W Cai, C Li, ELL Pai, TLR Fung, ... bioRxiv, 2022.03. 23.485555, 2022 | 1 | 2022 |
| Thermal Management of Electronics and Optoelectronics: From Heat Source Characterization to Heat Mitigation at the Device and Package Levels C Li | 1 | 2019 |
Kevin PipeUniversity of Michigan在 umich.edu 的电子邮件经过验证
