| Drop impact reliability testing for lead-free and lead-based soldered IC packages DYR Chong, FX Che, JHL Pang, K Ng, JYN Tan, PTH Low Microelectronics reliability 46 (7), 1160-1171, 2006 | 218 | 2006 |
| Effect of copper TSV annealing on via protrusion for TSV wafer fabrication A Heryanto, WN Putra, A Trigg, S Gao, WS Kwon, FX Che, XF Ang, J Wei, ... Journal of electronic materials 41, 2533-2542, 2012 | 174 | 2012 |
| The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures FX Che, WH Zhu, ESW Poh, XW Zhang, XR Zhang Journal of Alloys and Compounds 507 (1), 215-224, 2010 | 169 | 2010 |
| Vibration reliability test and finite element analysis for flip chip solder joints FX Che, JHL Pang Microelectronics reliability 49 (7), 754-760, 2009 | 138 | 2009 |
| Impact of thermal cycling on Sn-Ag-Cu solder joints and board-level drop reliability L Xu, JHL Pang, F Che Journal of Electronic Materials 37, 880-886, 2008 | 124 | 2008 |
| Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn–3.8 Ag–0.7 Cu solder joints FX Che, JHL Pang Journal of Alloys and Compounds 541, 6-13, 2012 | 122 | 2012 |
| Study on Cu protrusion of through-silicon via FX Che, WN Putra, A Heryanto, A Trigg, X Zhang, CL Gan IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (5 …, 2013 | 98 | 2013 |
| Thermal fatigue reliability analysis for PBGA with Sn-3.8 Ag-0.7 Cu solder joints FX Che, JHL Pang Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004 …, 2004 | 98 | 2004 |
| Fatigue reliability analysis of Sn–Ag–Cu solder joints subject to thermal cycling FX Che, JHL Pang IEEE Transactions on Device and Materials Reliability 13 (1), 36-49, 2012 | 95 | 2012 |
| High-reliability low-Ag-content Sn-Ag-Cu solder joints for electronics applications DA Shnawah, SBM Said, MFM Sabri, IA Badruddin, FX Che Journal of electronic materials 41, 2631-2658, 2012 | 92 | 2012 |
| Modeling and design solutions to overcome warpage challenge for fan-out wafer level packaging (FO-WLP) technology FX Che, D Ho, MZ Ding, X Zhang 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-8, 2015 | 86 | 2015 |
| Study on process induced wafer level warpage of fan-out wafer level packaging FX Che, D Ho, MZ Ding, DR MinWoo 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1879-1885, 2016 | 77 | 2016 |
| Interaction of multiple inhomogeneous inclusions beneath a surface K Zhou, LM Keer, QJ Wang, X Ai, K Sawamiphakdi, P Glaws, M Paire, ... Computer methods in applied mechanics and engineering 217, 25-33, 2012 | 71 | 2012 |
| Microstructure, mechanical, and thermal properties of the Sn–1Ag–0.5 Cu solder alloy bearing Fe for electronics applications DAA Shnawah, SBM Said, MFM Sabri, IA Badruddin, FX Che Materials Science and Engineering: A 551, 160-168, 2012 | 69 | 2012 |
| Modeling and simulation of printed circuit board drop test YQ Wang, KH Low, FX Che, HLJ Pang, SP Yeo Proceedings of the 5th Electronics Packaging Technology Conference (EPTC …, 2003 | 69 | 2003 |
| Microstructural stability of Sn–1Ag–0.5 Cu–xAl (x= 1, 1.5, and 2 wt.%) solder alloys and the effects of high-temperature aging on their mechanical properties MFM Sabri, DA Shnawah, IA Badruddin, SBM Said, FX Che, T Ariga Materials Characterization 78, 129-143, 2013 | 63 | 2013 |
| Effect of Ag content and the minor alloying element Fe on the mechanical properties and microstructural stability of Sn-Ag-Cu solder alloy under high-temperature annealing DA Shnawah, MFM Sabri, IA Badruddin, SBM Said, T Ariga, FX Che Journal of electronic materials 42, 470-484, 2013 | 61 | 2013 |
| Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards Y Wang, KH Low, HLJ Pang, KH Hoon, FX Che, YS Yong Microelectronics Reliability 46 (2-4), 558-573, 2006 | 59 | 2006 |
| Modeling constitutive model effect on reliability of lead-free solder joints FX Che, HLJ Pang, WH Zhu, W Sun, AYS Sun 2006 7th International Conference on Electronic Packaging Technology, 1-6, 2006 | 56 | 2006 |
| Drop impact analysis of Sn-Ag-Cu solder joints using dynamic high-strain rate plastic strain as the impact damage driving force JHL Pang, FX Che 56th Electronic Components and Technology Conference 2006, 6 pp., 2006 | 52 | 2006 |
John H L PANGNanyang Technological University在 ntu.edu.sg 的电子邮件经过验证
