| Effect of soft and hard inclusions in tensile deformation and damage mechanism of Aluminum: A molecular dynamics study A Rajput, SK Paul Journal of Alloys and Compounds 869, 159213, 2021 | 24 | 2021 |
| Cyclic plastic deformation response of nanocrystalline BCC iron A Rajput, SK Paul Metals and Materials International 27, 825-837, 2021 | 16 | 2021 |
| Effect of different tensile loading modes on deformation behavior of nanocrystalline copper: atomistic simulations A Rajput, SK Paul Results in Materials 4, 100042, 2019 | 10 | 2019 |
| Deformation inhomogeneity at the crack tip of polycrystalline copper A Rajput, SK Paul Materials Today Communications 26, 101781, 2021 | 7 | 2021 |
| A Review: Erosion Wear Models Gautam Yadav, Sudhir Tiwari, Ashutosh Rajput, Ravi Jatola, M L Jain International Conference on Emerging Trends in Mechanical Engineering …, 2016 | 7* | 2016 |
| Understanding the physics of non-linear unloading-reloading behavior of metal for springback prediction A Rajput, SK Paul Journal of Molecular Modeling 25 (11), 321, 2019 | 6 | 2019 |
| Monotonic and cyclic plastic deformation behavior of nanocrystalline gold: atomistic simulations A Rajput, P Ghosal, A Kumar, SK Paul Journal of Molecular Modeling 25, 1-10, 2019 | 6 | 2019 |
| Effect of void in deformation and damage mechanism of single crystal copper: A molecular dynamics study A Rajput, SK Paul Modelling and Simulation in Materials Science and Engineering 29 (8), 085013, 2021 | 5 | 2021 |
| Influence of hard inclusion on Bauschinger effect and cyclic deformation behavior: an atomistic simulation on single-crystal and polycrystal aluminum A Rajput, SK Paul Materials Today Communications 34, 105126, 2023 | 3 | 2023 |
| A review on computational modeling of instability and degradation issues of halide perovskite photovoltaic materials P Bhatt, AK Pandey, A Rajput, KK Sharma, A Moyez, A Tewari Wiley Interdisciplinary Reviews: Computational Molecular Science 13 (6), e1677, 2023 | 2 | 2023 |
| Molecular dynamics simulation of dry sliding between non-Gaussian copper rough surfaces S Kumar, A Rajput, SK Paul, M Tiwari Applied Surface Science 664, 160220, 2024 | 1 | 2024 |
| Friction and wear study of metallic contacts under dry sliding conditions: A molecular dynamics simulation-based approach S Kumar, A Rajput, SK Paul, M Tiwari, DK Prajapati Proceedings of the Institution of Mechanical Engineers, Part J: Journal of …, 2024 | 1 | 2024 |
| Bauschinger Effect Analysis in Polycrystalline Copper: an Atomistic Simulation A Rajput, SK Paul Transactions of the Indian National Academy of Engineering, 1-8, 2021 | 1 | 2021 |
| INFLUENCE OF MAGNESIUM INCLUSION IN CYCLIC DEFORMATION OF SINGLE-CRYSTAL ALUMINIUM: A MOLECULAR DYNAMIC STUDY Ashutosh Rajput, Surajit Kumar Paul 9th International Conference on Mechanics and Materials in Design Funchal …, 2022 | | 2022 |
| Effect of Surface Texture on the Steady-state Characteristics of Journal Bearing and Its Comparisons Ashutosh Rajput, Lintu Roy American Journal of Mechanical and Materials Engineering 5 (4), 84-92, 2021 | | 2021 |
| Investigation of tribological behaviour of unalloyed aluminium Gautam Yadav, Sudhir Tiwari, Ashutosh Rajput, Ravi Jatola, M L Jain National Conference on Emanate Trends in Mechanical & Allied Engineering …, 2016 | | 2016 |
Surajit Kumar PaulAssociate Professor, Department of Mechanical Engineering, Indian Institute of Technology Patna在 tatasteel.com 的电子邮件经过验证
