| Data clustering: theory, algorithms, and applications G Gan, C Ma, J Wu Society for Industrial and Applied Mathematics, 2020 | 2609 | 2020 |
| Rainbow trapping in hyperbolic metamaterial waveguide H Hu, D Ji, X Zeng, K Liu, Q Gan Scientific reports 3 (1), 1249, 2013 | 208 | 2013 |
| Experimental verification of the rainbow trapping effect in adiabatic plasmonic gratings Q Gan, Y Gao, K Wagner, D Vezenov, YJ Ding, FJ Bartoli Proceedings of the National Academy of Sciences 108 (13), 5169-5173, 2011 | 169 | 2011 |
| Crumpled graphene triboelectric nanogenerators: smaller devices with higher output performance H Chen, Y Xu, L Bai, Y Jiang, J Zhang, C Zhao, T Li, H Yu, G Song, ... Advanced Materials Technologies 2 (6), 1700044, 2017 | 89 | 2017 |
| Polymeric photovoltaics with various metallic plasmonic nanostructures B Zeng, Q Gan, ZH Kafafi, FJ Bartoli Journal of Applied Physics 113 (6), 2013 | 66 | 2013 |
| Evolutions of bonding wires used in semiconductor electronics: perspective over 25 years CL Gan, U Hashim Journal of Materials Science: Materials in Electronics 26, 4412-4424, 2015 | 56 | 2015 |
| Technical barriers and development of Cu wirebonding in nanoelectronics device packaging CL Gan, EK Ng, BL Chan, U Hashim, FC Classe Journal of Nanomaterials 2012 (1), 173025, 2012 | 47 | 2012 |
| Extended reliability of gold and copper ball bonds in microelectronic packaging CL Gan, C Francis, BL Chan, U Hashim gold Bulletin 46, 103-115, 2013 | 41 | 2013 |
| Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging CL Gan, EK Ng, BL Chan, FC Classe, T Kwuanjai, U Hashim Journal of Nanomaterials 2013 (1), 486373, 2013 | 32 | 2013 |
| Environmental friendly package development by using copper wirebonding CL Gan, TT Toong, CP Lim, CY Ng 2010 34th IEEE/CPMT International Electronic Manufacturing Technology …, 2010 | 30 | 2010 |
| Evolution and investigation of copper and gold ball bonds in extended reliability stressing CL Gan, FC Classe, BL Chan, U Hashim Gold Bulletin 47, 141-151, 2014 | 28 | 2014 |
| Graded metallic gratings for ultrawideband surface wave trapping at THz frequencies Q Gan, FJ Bartoli IEEE Journal of Selected Topics in Quantum Electronics 17 (1), 102-109, 2010 | 28 | 2010 |
| Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging CL Gan, U Hashim PLosOne 8 (11), 1-8, 2013 | 26* | 2013 |
| Prognostics and Health Management of Electronics: Fundamentals, Machine Learning, and the Internet of Things: John Wiley & Sons Ltd.(2018). pp. 731, ISBN: 9781119515326 (Print … CL Gan Life Cycle Reliability and Safety Engineering 9 (2), 225-226, 2020 | 24 | 2020 |
| Effects of bonding wires and epoxy molding compound on gold and copper ball bonds intermetallic growth kinetics in electronic packaging CL Gan, FC Classe, BL Chan, U Hashim Journal of electronic materials 43, 1017-1025, 2014 | 24 | 2014 |
| Effect of palladium on the mechanical properties of Cu–Al intermetallic compounds ABY Lim, X Long, L Shen, X Chen, RV Ramanujan, CL Gan, Z Chen Journal of Alloys and Compounds 628, 107-112, 2015 | 23 | 2015 |
| Future and technical considerations of gold wirebonding in semiconductor packaging–a technical review C Leong Gan, F Classe, B Lee Chan, U Hashim Microelectronics International 31 (2), 121-128, 2014 | 23 | 2014 |
| A review of interconnect materials used in emerging memory device packaging: First-and second-level interconnect materials YS Zou, CL Gan, MH Chung, H Takiar Journal of Materials Science: Materials in Electronics 32 (23), 27133-27147, 2021 | 22 | 2021 |
| Radiative cooling for energy sustainability: Materials, systems, and applications L Zhou, J Rada, Y Tian, Y Han, Z Lai, MF McCabe, Q Gan Physical Review Materials 6 (9), 090201, 2022 | 20 | 2022 |
| Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package CL Gan, U Hashim Journal of Materials Science: Materials in Electronics 24, 2803-2811, 2013 | 20 | 2013 |
Vance Liu (Wen Ju Liu)Johns Hopkins University / Micron Technology Incorporation在 micron.com 的电子邮件经过验证
Vance Liu (Wen Ju Liu)Johns Hopkins University / Micron Technology Incorporation在 micron.com 的电子邮件经过验证
Uda HashimProfessor in Nanoelectronic and Microelectronic Engineering