Heat transfer—A review of 2004 literature RJ Goldstein, WE Ibele, SV Patankar, TW Simon, TH Kuehn, ... International Journal of Heat and Mass Transfer 53 (21-22), 4343-4396, 2010 | 134 | 2010 |
Droplet Dynamics in a microchannel subjested to electrocapillary actuation S Chakraborty, R Mittal Journal of Applied Physics, 2007 | 30 | 2007 |
Package-on-package (PoP) device comprising bi-directional thermal electric cooler R Mittal, HJ Park, P Wang, M Saeidi, A Mittal US Patent 9,746,889, 2017 | 29 | 2017 |
The heat/mass transfer analogy for a backward facing step R Mittal, U Madanan, RJ Goldstein International Journal of Heat and Mass Transfer 113 (October 2017), 411-422, 2017 | 25 | 2017 |
Experimental Validation of Heat / Mass Transfer Analogy for Two-Dimensional Laminar and Turbulent Boundary Layers KS Kulkarni, U Madanan, R Mittal, RJ Goldstein International Journal of Heat and Mass Transfer 113, 84-95, 2017 | 24 | 2017 |
Thermal mitigation of multi-core processor R Mittal, M Krishnappa, R Chandra, M Tamjidi, M Tamjidi US Patent US9,582,052, 2015 | 15 | 2015 |
Thermal solution for wearable devices by using wrist band as heat sink M Saeidi, E Rahim, R Mittal, A Mittal US Patent 9,652,005, 2017 | 13 | 2017 |
Thermal implications of mobile 3D-ICs M Saeidi, K Samadi, A Mittal, Mittal, R. 3D Systems Integration Conference (3DIC), 2014 International, 2014 | 12 | 2014 |
Algorithm for preferred core sequencing to maximize performance and reduce chip temperature and power R Mittal, M Saeidi, T Xue, RF Alton, R Chandra, S Dasnurkar US Patent 9,557,797, 2017 | 11 | 2017 |
Heat transfer electromagnetic interference shield M Saeidi, E Rahim, R Mittal, A Mittal US Patent App. 14/957,569, 2017 | 10 | 2017 |
Thermal management of electronic headsets E Rahim, M Saeidi, A Mittal, R Mittal US Patent App. 14/843,973, 2017 | 10 | 2017 |
Thermal sensor placement for hotspot interpolation RM Coutts, R Mittal, M Saeidi, PI Penzes US Patent 10,401,235, 2019 | 9 | 2019 |
Adaptive thermal control and power budget HJ Park, R Mittal, M Saeidi US Patent 9,983,557, 2018 | 9 | 2018 |
Thermally-constrained voltage and frequency scaling R Mittal, M Saeidi US Patent 9,625,963, 2017 | 7 | 2017 |
Thermal simulations using convolution and iterative methods RM Coutts, A Mittal, R Mittal, MW Allam, M Saeidi US Patent App. 14/502,752, 2016 | 7 | 2016 |
Circuits and Methods Providing Thread Assignment for a Multi-Core Processor M Saeidi, S Vivek, T Khadivi, R Coutts, R Alton, P Jain, R Mittal US Patent App. 15/373,067, 2018 | 5 | 2018 |
Circuits and methods providing temperature mitigation for computing devices M Saeidi, A Mittal, F Mahmoudi, R Mittal US Patent App. 14/852,941, 2017 | 5 | 2017 |
Thermal arm for drone S Vivek, M Saeidi, R Mittal, M Roshandell US Patent 10,358,230, 2019 | 4 | 2019 |
Thermal mitigation of multi-core processor R Mittal, M Krishnappa, R Chandra, M Tamjidi US Patent 10,114,443, 2018 | 4 | 2018 |
Circuits and methods providing calibration for temperature mitigation in a computing device M Saeidi, M Roshandell, R Mittal US Patent 10,007,310, 2018 | 4 | 2018 |