| Flexible hybrid electronics: Direct interfacing of soft and hard electronics for wearable health monitoring Y Khan, M Garg, Q Gui, M Schadt, A Gaikwad, D Han, NAD Yamamoto, ... Advanced Functional Materials 26 (47), 8764-8775, 2016 | 325 | 2016 |
| Study of the interlayer expansion mechanism and thermal–mechanical properties of surface-initiated epoxy nanocomposites JS Chen, MD Poliks, CK Ober, Y Zhang, U Wiesner, E Giannelis Polymer 43 (18), 4895-4904, 2002 | 280 | 2002 |
| Reworkable epoxies: thermosets with thermally cleavable groups for controlled network breakdown S Yang, JS Chen, H Körner, T Breiner, CK Ober, MD Poliks Chemistry of materials 10 (6), 1475-1482, 1998 | 217 | 1998 |
| Multi-layered interconnect structure using liquid crystalline polymer dielectric FD Egitto, DS Farquhar, VR Markovich, MD Poliks, DO Powell US Patent 7,301,108, 2007 | 181 | 2007 |
| Tamper-responding encapsulated enclosure having flexible protective mesh structure DS Farquhar, C Feger, V Markovich, KI Papathomas, MD Poliks, JM Shaw, ... US Patent 6,929,900, 2005 | 160 | 2005 |
| Controlled degradation of epoxy networks: analysis of crosslink density and glass transition temperature changes in thermally reworkable thermosets JS Chen, CK Ober, MD Poliks, Y Zhang, U Wiesner, C Cohen Polymer 45 (6), 1939-1950, 2004 | 152 | 2004 |
| Characterization of thermally reworkable thermosets: materials for environmentally friendly processing and reuse JS Chen, CK Ober, MD Poliks Polymer 43 (1), 131-139, 2002 | 149 | 2002 |
| Conformation of microtubule-bound paclitaxel determined by fluorescence spectroscopy and REDOR NMR Y Li, B Poliks, L Cegelski, M Poliks, Z Gryczynski, G Piszczek, PG Jagtap, ... Biochemistry 39 (2), 281-291, 2000 | 141 | 2000 |
| Computational fluid dynamics modeling and online monitoring of aerosol jet printing process R Salary, JP Lombardi, M Samie Tootooni, R Donovan, PK Rao, ... Journal of Manufacturing Science and Engineering 139 (2), 021015, 2017 | 112 | 2017 |
| Dielectric composition and solder interconnection structure for its use K Papathomas, MD Poliks, DW Wang, FR Christie US Patent 5,194,930, 1993 | 111 | 1993 |
| High-resolution carbon-13 and nitrogen-15 NMR investigations of the mechanism of the curing reactions of cyanate-based polymer resins in solution and the solid state CA Fyfe, J Niu, SJ Rettig, NE Burlinson Macromolecules 25 (23), 6289-6301, 1992 | 105 | 1992 |
| Low CTE power and ground planes RM Japp, MD Poliks US Patent 6,329,603, 2001 | 85 | 2001 |
| Flexible chemiresistor sensors: Thin film assemblies of nanoparticles on a polyethylene terephthalate substrate L Wang, J Luo, J Yin, H Zhang, J Wu, X Shi, E Crew, Z Xu, Q Rendeng, ... Journal of Materials Chemistry 20 (5), 907-915, 2010 | 82 | 2010 |
| Method and structure for producing Z-axis interconnection assembly of printed wiring board elements BE Curcio, DS Farquhar, KI Papathomas, MD Poliks US Patent 6,465,084, 2002 | 82 | 2002 |
| Method for filling high aspect ratio via holes in electronic substrates and the resulting holes BE Curcio, PA Gruber, F Maurer, KI Papathomas, MD Poliks US Patent 6,452,117, 2002 | 78 | 2002 |
| NMR investigation of chain deformation in sheared polymer fluids AI Nakatani, MD Poliks, ET Samulski Macromolecules 23 (10), 2686-2692, 1990 | 78 | 1990 |
| Electronic package utilizing protective coating RD Havens, RM Japp, JA Knight, MD Poliks, AM Quinn US Patent 6,351,030, 2002 | 58 | 2002 |
| Heart monitor using flexible capacitive ECG electrodes Y Gao, VV Soman, JP Lombardi, PP Rajbhandari, TP Dhakal, DG Wilson, ... IEEE Transactions on Instrumentation and Measurement 69 (7), 4314-4323, 2019 | 56 | 2019 |
| Online monitoring of functional electrical properties in aerosol jet printing additive manufacturing process using shape-from-shading image analysis R Salary, JP Lombardi, PK Rao, MD Poliks Journal of Manufacturing Science and Engineering 139 (10), 101010, 2017 | 55 | 2017 |
| Conductive metal micro-pillars for enhanced electrical interconnection RN Das, KI Papathomas, MD Poliks, VR Markovich US Patent App. 13/082,502, 2012 | 55 | 2012 |
Jack Lombardi在 binghamton.edu 的电子邮件经过验证
