| Embedded multi-die interconnect bridge (EMIB)--a high density, high bandwidth packaging interconnect R Mahajan, R Sankman, N Patel, DW Kim, K Aygun, Z Qian, Y Mekonnen, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 557-565, 2016 | 330 | 2016 |
| Analysis of transient electromagnetic scattering from closed surfaces using a combined field integral equation B Shanker, AA Ergin, K Aygun, E Michielssen IEEE Transactions on Antennas and Propagation 48 (7), 1064-1074, 2000 | 209 | 2000 |
| X-line routing for dense multi-chip-package interconnects Z Qian, K Aygun US Patent 8,946,900, 2015 | 131 | 2015 |
| Analysis of transient electromagnetic scattering phenomena using a two-level plane wave time-domain algorithm B Shanker, AA Ergin, K Aygun, E Michielssen IEEE Transactions on Antennas and Propagation 48 (4), 510-523, 2000 | 123 | 2000 |
| A two-level plane wave time-domain algorithm for fast analysis of EMC/EMI problems K Aygun, B Shanker, AA Ergin, E Michielssen IEEE transactions on electromagnetic compatibility 44 (1), 152-164, 2002 | 96 | 2002 |
| A fast hybrid field-circuit simulator for transient analysis of microwave circuits K Aygun, BC Fischer, J Meng, B Shanker, E Michielssen IEEE Transactions on Microwave Theory and Techniques 52 (2), 573-583, 2004 | 82 | 2004 |
| Embedded multidie interconnect bridge—A localized, high-density multichip packaging interconnect R Mahajan, Z Qian, RS Viswanath, S Srinivasan, K Aygün, WL Jen, ... IEEE transactions on components, packaging and manufacturing technology 9 …, 2019 | 74 | 2019 |
| Power Delivery for High-Performance Microprocessors. K Aygün, MJ Hill, K Eilert, K Radhakrishnan, A Levin Intel Technology Journal 9 (4), 2005 | 69 | 2005 |
| Universal chiplet interconnect express (UCIe): An open industry standard for innovations with chiplets at package level DD Sharma, G Pasdast, Z Qian, K Aygun IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 58 | 2022 |
| Input/output package architectures S Ganesan, K Aygun, C Ramaswamy, E Palmer, H Braunisch US Patent 8,188,594, 2012 | 57 | 2012 |
| Co-packaged photonics for high performance computing: status, challenges and opportunities R Mahajan, X Li, J Fryman, Z Zhang, S Nekkanty, P Tadayon, J Jaussi, ... Journal of Lightwave Technology 40 (2), 379-392, 2021 | 54 | 2021 |
| An enhanced augmented electric-field integral equation formulation for dielectric objects T Xia, H Gan, M Wei, WC Chew, H Braunisch, Z Qian, K Aygün, A Aydiner IEEE Transactions on Antennas and Propagation 64 (6), 2339-2347, 2016 | 54 | 2016 |
| Integral-equation-based analysis of transient scattering and radiation from conducting bodies at very low frequencies NW Chen, K Aygün, E Michielssen IEE Proceedings-Microwaves, Antennas and Propagation 148 (6), 381-387, 2001 | 49 | 2001 |
| Interconnect routing configurations and associated techniques Z Qian, K Aygun, D Kim US Patent 9,542,522, 2017 | 46 | 2017 |
| Embedded capacitors in the next generation processor Y Min, R Olmedo, M Hill, K Radhakrishnan, K Aygun, M Kabiri-Badr, ... 2013 IEEE 63rd electronic components and technology conference, 1225-1229, 2013 | 36 | 2013 |
| An integral equation modeling of lossy conductors with the enhanced augmented electric field integral equation T Xia, H Gan, M Wei, WC Chew, H Braunisch, Z Qian, K Aygün, A Aydiner IEEE Transactions on Antennas and Propagation 65 (8), 4181-4190, 2017 | 33 | 2017 |
| Transient analysis of multielement wire antennas mounted on arbitrarily shaped perfectly conducting bodies K Aygün, SE Fisher, AA Ergin, B Shanker, E Michielssen Radio Science 34 (4), 781-796, 1999 | 33 | 1999 |
| Causal and passive parameterization of S-parameters using neural networks HM Torun, AC Durgun, K Aygün, M Swaminathan IEEE Transactions on Microwave Theory and Techniques 68 (10), 4290-4304, 2020 | 32 | 2020 |
| Fast analysis of transient scattering from lossy inhomogeneous dielectric bodies B Shanker, K Aygün, E Michielssen Radio Science 39 (2), 1-14, 2004 | 31 | 2004 |
| Input/output package architectures, and methods of using same S Ganesan, K Aygun, C Ramaswamy, E Palmer, H Braunisch US Patent 7,705,447, 2010 | 27 | 2010 |
