受强制性开放获取政策约束的文章 - Alexis Farcy了解详情
无法在其他位置公开访问的文章：6 篇
2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm2 Inter-Chiplet Interconnects and 156mW/mm …
P Vivet, E Guthmuller, Y Thonnart, G Pillonnet, G Moritz, I Miro-Panadès, ...
2020 IEEE International Solid-State Circuits Conference-(ISSCC), 46-48, 2020
强制性开放获取政策： Agence Nationale de la Recherche
Active interposer technology for chiplet-based advanced 3D system architectures
P Coudrain, J Charbonnier, A Garnier, P Vivet, R Vélard, A Vinci, ...
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 569-578, 2019
强制性开放获取政策： Agence Nationale de la Recherche
Characterization of fine pitch hybrid bonding pads using electrical misalignment test vehicle
I Jani, D Lattard, P Vivet, L Arnaud, S Cheramy, E Beigné, A Farcy, ...
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1926-1932, 2019
强制性开放获取政策： Agence Nationale de la Recherche
New challenges and opportunities for 3D integrations
J Michailos, P Coudrain, A Farcy, N Hotellier, S Cheramy, S Lhostis, ...
2015 IEEE International Electron Devices Meeting (IEDM), 8.5. 1-8.5. 4, 2015
强制性开放获取政策： European Commission
Co-integration of TSV mid process and optical devices for Silicon photonics interposers
P Tissier, J Charbonnier, R Vélard, F Ponthenier, A Farcy, F Boeuf, ...
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 1-5, 2020
强制性开放获取政策： Agence Nationale de la Recherche
3D sequential integration: applications and associated key enabling modules (design & technology)
P Batude, O Billoint, S Thuries, P Malinge, C Fenouillet-Beranger, ...
2021 IEEE International Electron Devices Meeting (IEDM), 3.2. 1-3.2. 4, 2021
强制性开放获取政策： European Commission
可在其他位置公开访问的文章：3 篇
IntAct: A 96-core processor with six chiplets 3D-stacked on an active interposer with distributed interconnects and integrated power management
P Vivet, E Guthmuller, Y Thonnart, G Pillonnet, C Fuguet, I Miro-Panades, ...
IEEE Journal of Solid-State Circuits 56 (1), 79-97, 2020
强制性开放获取政策： Agence Nationale de la Recherche
On the material depletion rate due to electromigration in a copper TSV structure
RL de Orio, S Gousseau, S Moreau, H Cerice, S Selberherr, A Farcy, ...
2014 IEEE International Integrated Reliability Workshop Final Report (IIRW …, 2014
强制性开放获取政策： Austrian Science Fund
Backside cavities for thermal tuning optimization of silicon ring resonators
P Tissier, K Hassan, V Reboud, R Vélard, P Grosse, S Bernabé, ...
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1667-1672, 2021
强制性开放获取政策： Agence Nationale de la Recherche
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