| Antenna-integrated, die-embedded glass package for 6G wireless applications X Jia, X Li, K Moon, JW Kim, KQ Huang, MB Jordan, M Swaminathan 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 377-383, 2022 | 14 | 2022 |
| Characterization of chip-to-package interconnects for glass panel embedding (GPE) for sub-THz wireless communications S Erdogan, S Ravichandran, X Jia, M Swaminathan 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2328-2333, 2021 | 11 | 2021 |
| Antenna with embedded die in glass interposer for 6g wireless applications X Jia, X Li, S Erdogan, KS Moon, JW Kim, KQ Huang, MB Jordan, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 13 …, 2023 | 9 | 2023 |
| Extrapolation with Range Determination of 2D Spectral Transposed Convolutional Neural Network for Advanced Packaging Problems Y Guo, X Jia, X Li, Y Wang, R Kumar, R Sharma, M Swaminathan IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023 | 4 | 2023 |
| Bottom Side Cooling for Glass Interposer with Chip Embedding using Double-sided Release Process for 6G Wireless Applications JW Kim, X Li, X Jia, KS Moon, M Swaminathan 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1609-1613, 2023 | 4 | 2023 |
| Die-embedded glass packaging for 6G wireless applications X Jia, X Li, KS Moon, M Swaminathan MRS Advances 7 (29), 630-634, 2022 | 4 | 2022 |
| Design and Characterization of Metalized Trench Based Waveguide Technology on Glass Interposer for 6G Applications X Li, X Jia, S Erdogan, M Jordan, M Swaminathan 2023 IEEE/MTT-S International Microwave Symposium-IMS 2023, 684-687, 2023 | 1 | 2023 |
| Die-Embedded Glass Interposer with Minimum Warpage for 5G/6G Applications X Li, X Jia, JW Kim, KS Moon, MB Jordan, M Swaminathan 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2247-2254, 2023 | 1 | 2023 |
| Design and Characterization of Bandpass Filter with Multiple Zeros on Glass Interposer for 6G Applications X Li, X Jia, S Erdogan, M Swaminathan 2023 IEEE Radio and Wireless Symposium (RWS), 98-100, 2023 | 1 | 2023 |
| Integrated low-loss planar goubau lines on glass interposer for 6G wireless applications X Jia, M Swaminathan 2022 IEEE/MTT-S International Microwave Symposium-IMS 2022, 367-370, 2022 | 1 | 2022 |
| A Low Loss Die-Embedded Glass Substrate for 140 GHz InP Power Amplifier Integration X Jia, X Li, JW Kim, K Moon, MJW Rodwell, M Swaminathan 2024 IEEE/MTT-S International Microwave Symposium-IMS 2024, 402-405, 2024 | | 2024 |
| Chip-embedded Glass Interposer for 5G Applications X Li, X Jia, K Moon, JW Kim, A Pandey, A Chiu, A Kenerson, ... 2023 IEEE Radio and Wireless Symposium (RWS), 129-131, 2023 | | 2023 |
