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Jianxun Yang
Jianxun Yang
在 mails.tsinghua.edu.cn 的电子邮件经过验证
标题
引用次数
引用次数
年份
An energy-efficient reconfigurable processor for binary-and ternary-weight neural networks with flexible data bit width
S Yin, P Ouyang, J Yang, T Lu, X Li, L Liu, S Wei
IEEE Journal of Solid-State Circuits 54 (4), 1120-1136, 2018
592018
An ultra-high energy-efficient reconfigurable processor for deep neural networks with binary/ternary weights in 28nm CMOS
S Yin, P Ouyang, J Yang, T Lu, X Li, L Liu, S Wei
2018 IEEE Symposium on VLSI Circuits, 37-38, 2018
372018
TIMAQ: A time-domain computing-in-memory-based processor using predictable decomposed convolution for arbitrary quantized DNNs
J Yang, Y Kong, Z Zhang, Z Liu, J Zhou, Y Wang, Y Liu, C Guo, T Hu, C Li, ...
IEEE Journal of Solid-State Circuits 56 (10), 3021-3038, 2021
172021
A two-stage variation-aware task mapping scheme for fault-tolerant multi-core Network-on-Chips
L Zhang, J Yang, C Xue, Y Ma, S Cao
2017 IEEE International Symposium on Circuits and Systems (ISCAS), 1-4, 2017
142017
A time-domain computing-in-memory based processor using predictable decomposed convolution for arbitrary quantized DNNs
J Yang, Y Kong, Z Zhang, Z Liu, J Zhou, Y Wang, Y Liu, C Guo, T Hu, C Li, ...
2020 IEEE Asian Solid-State Circuits Conference (A-SSCC), 1-4, 2020
52020
An accurate power and temperature simulation framework for network-on-chip
J Yang, S Cao
2016 International Conference on Integrated Circuits and Microsystems (ICICM …, 2016
42016
An Energy-Efficient Architecture for Accelerating Inference of Memory-Augmented Neural Networks
J Yang, L Liu, J Zhang, S Wei, S Yin
2019 IEEE/ACM International Symposium on Nanoscale Architectures (NANOARCH), 1-6, 2019
2019
An analytical model for capacitance of silicon-insulator-silicon through-silicon-vias
B Li, M Xiong, J Yang, Z Chen, Y Ding
2016 17th International Conference on Electronic Packaging Technology (ICEPT …, 2016
2016
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