受强制性开放获取政策约束的文章 - Hemanth Kumar Cheemalamarri了解详情
无法在其他位置公开访问的文章：8 篇
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CMOS-compatible fine pitch Al-Al bonding
HK Cheemalamarri, B Varghese, S Jaibir, L Hongyu, CR SS, N Singh, ...
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1725-1729, 2023
强制性开放获取政策： A*Star, Singapore
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Fabrication of On-Silicon Aperture Coupled Patch Antenna Through Micromachining and Cu-Cu Thermocompression Bonding
S Bonam, J Joseph, CH Kumar, AK Panigrahi, SRK Vanjari, SG Singh
IEEE Transactions on Semiconductor Manufacturing 35 (4), 626-632, 2022
强制性开放获取政策： Department of Science & Technology, India
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Ultrathin New Dielectric Interlayer Layer-Enhancer for TEOS-TEOS Bond Strength at Low Thermal Budget for C2W and W2W Bonding Applications
HK Cheemalamarri, SLH Jang, JH Miao, V Nandini, CR BSS, CK Jien, ...
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 625-628, 2023
强制性开放获取政策： A*Star, Singapore
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Ti/Si interface enabling complementary metal oxide semiconductor compatible, high reliable bonding for inter-die micro-fluidic cooling for future advanced 3D integrated circuit …
HK Cheemalamarri, S Bonam, SRK Vanjari, SG Singh
Journal of Micromechanics and Microengineering 30 (10), 105005, 2020
强制性开放获取政策： Department of Science & Technology, India
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Study of Cu Pad Expansion with Surrounding Dielectrics for Hybrid Bonding
HK Cheemalamarri, J Lir, W Lee, VS Rao, N Singh
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 493-497, 2023
强制性开放获取政策： A*Star, Singapore
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Room Temperature Plasma-Enhanced Niobium-Niobium Wafer Bonding for 3D Integration of Superconducting Interconnects for Quantum Processing
SCK Goh, CH Kumar, L Hu, W Shervonne, N Jaafar, YLK Sherry, ...
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 404-408, 2023
强制性开放获取政策： A*Star, Singapore
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Through Silicon Via Oxide Etch Back for Via-last Integration Scheme
HK Cheemalamarri, D Senthilkumar, BSSC Rao
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 973-976, 2022
强制性开放获取政策： A*Star, Singapore
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Interface Analysis of High Reliable Hermitic Sealed Microfluidic Channels for Thermal Cooling in 3D ICs
HK Cheemalamarri, S Bonam, D Banik, SRK Vanjari, SG Singh
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 71-74, 2019
强制性开放获取政策： Department of Science & Technology, India
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