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Atsushi Ogura
Atsushi Ogura
在 meiji.ac.jp 的电子邮件经过验证
标题
引用次数
引用次数
年份
Raman spectra of size-selected silicon clusters and comparison with calculated structures
EC Honea, A Ogura, CA Murray, K Raghavachari, WO Sprenger, ...
Nature 366 (6450), 42-44, 1993
4921993
Semiconductor device
A Ogura, K Egami
US Patent 4,643,950, 1987
2441987
UV-Raman spectroscopy system for local and global strain measurements in Si
A Ogura, K Yamasaki, D Kosemura, S Tanaka, I Chiba, R Shimidzu
Japanese journal of applied physics 45 (4S), 3007, 2006
1142006
Structures and coalescence behavior of size-selected silicon nanoclusters studied by surface-plasmon-polariton enhanced Raman spectroscopy
EC Honea, A Ogura, DR Peale, C Felix, CA Murray, K Raghavachari, ...
The Journal of chemical physics 110 (24), 12161-12172, 1999
1091999
Sub-10-nm planar-bulk-CMOS devices using lateral junction control
H Wakabayashi, S Yamagami, N Ikezawa, A Ogura, M Narihiro, KI Arai, ...
IEEE International Electron Devices Meeting 2003, 20.7. 1-20.7. 3, 2003
1042003
Gas source silicon molecular beam epitaxy using silane
H Hirayama, T Tatsumi, A Ogura, N Aizaki
Applied physics letters 51 (26), 2213-2215, 1987
1001987
Improvement in ferroelectricity of HfxZr1− xO2 thin films using ZrO2 seed layer
T Onaya, T Nabatame, N Sawamoto, A Ohi, N Ikeda, T Chikyow, A Ogura
Applied Physics Express 10 (8), 081501, 2017
872017
Silicon-on-insulator (SOI) substrate and method of fabricating the same
A Ogura
US Patent 6,211,041, 2001
812001
Method of producing a semiconductor on insulating substrate, and a method of forming a transistor thereon
R Koh, A Ogura
US Patent 5,427,976, 1995
771995
Ferroelectricity of HfxZr1− xO2 thin films fabricated by 300 C low temperature process with plasma-enhanced atomic layer deposition
T Onaya, T Nabatame, N Sawamoto, A Ohi, N Ikeda, T Nagata, A Ogura
Microelectronic Engineering 215, 111013, 2019
762019
Soi mosfet
R Koh, S Yamagami, J Lee, H Wakabayashi, Y Saito, A Ogura, M Narihiro, ...
US Patent 6,933,569, 2005
762005
Semiconductor device having a conductive portion below an interlayer insulating film and method for producing the same
K Takeuchi, K Terashima, H Wakabayashi, S Yamagami, A Ogura, ...
US Patent 7,612,416, 2009
712009
HfO2 growth by low-pressure chemical vapor deposition using the Hf (N (C2H5) 2) 4/O2 gas system
Y Ohshita, A Ogura, A Hoshino, S Hiiro, H Machida
Journal of crystal growth 233 (1-2), 292-297, 2001
702001
Semiconductor substrate manufacturing method and semiconductor device manufacturing method, and semiconductor substrate and semiconductor device manufactured by the methods
A Ogura
US Patent 7,605,443, 2009
672009
Skeletal muscle loss is an independent negative prognostic factor in patients with advanced lower rectal cancer treated with neoadjuvant chemoradiotherapy
Y Takeda, T Akiyoshi, K Matsueda, H Fukuoka, A Ogura, H Miki, Y Hiyoshi, ...
PloS one 13 (4), e0195406, 2018
622018
Improvement in ferroelectricity of HfxZr1− xO2 thin films using top-and bottom-ZrO2 nucleation layers
T Onaya, T Nabatame, N Sawamoto, A Ohi, N Ikeda, T Nagata, A Ogura
APL Materials 7 (6), 2019
602019
Semiconductor device having fin-type effect transistor
K Takeuchi, K Watanabe, K Terashima, A Ogura, T Tatsumi, K Takeda, ...
US Patent App. 10/569,451, 2007
592007
Characterization of structures by micro-Raman imaging
S Nakashima, T Yamamoto, A Ogura, K Uejima, T Yamamoto
Applied physics letters 84 (14), 2533-2535, 2004
592004
Using tetrakis-diethylamido-hafnium for HfO2 thin-film growth in low-pressure chemical vapor deposition
Y Ohshita, A Ogura, A Hoshino, S Hiiro, T Suzuki, H Machida
Thin Solid Films 406 (1-2), 215-218, 2002
592002
Semiconductor device and manufacturing process therefor
K Terashima, K Takeuchi, S Yamagami, H Wakabayashi, A Ogura, ...
US Patent App. 10/576,412, 2007
582007
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