Device exploration of nanosheet transistors for sub-7-nm technology node D Jang, D Yakimets, G Eneman, P Schuddinck, MG Bardon, P Raghavan, ... IEEE Transactions on Electron Devices 64 (6), 2707-2713, 2017 | 273 | 2017 |
Vertical GAAFETs for the ultimate CMOS scaling D Yakimets, G Eneman, P Schuddinck, TH Bao, MG Bardon, P Raghavan, ... IEEE Transactions on Electron Devices 62 (5), 1433-1439, 2015 | 218 | 2015 |
Understanding energy efficiency benefits of carbon nanotube field-effect transistors for digital VLSI G Hills, MG Bardon, G Doornbos, D Yakimets, P Schuddinck, R Baert, ... IEEE Transactions on Nanotechnology 17 (6), 1259-1269, 2018 | 145 | 2018 |
Vertically stacked gate-all-around Si nanowire transistors: Key process optimizations and ring oscillator demonstration H Mertens, R Ritzenthaler, V Pena, G Santoro, K Kenis, A Schulze, ... 2017 IEEE international electron devices meeting (IEDM), 37.4. 1-37.4. 4, 2017 | 134 | 2017 |
Novel forksheet device architecture as ultimate logic scaling device towards 2nm P Weckx, J Ryckaert, ED Litta, D Yakimets, P Matagne, P Schuddinck, ... 2019 IEEE International Electron Devices Meeting (IEDM), 36.5. 1-36.5. 4, 2019 | 128 | 2019 |
Power aware FinFET and lateral nanosheet FET targeting for 3nm CMOS technology D Yakimets, MG Bardon, D Jang, P Schuddinck, Y Sherazi, P Weckx, ... 2017 IEEE International Electron Devices Meeting (IEDM), 20.4. 1-20.4. 4, 2017 | 120 | 2017 |
Extreme scaling enabled by 5 tracks cells: Holistic design-device co-optimization for FinFETs and lateral nanowires MG Bardon, Y Sherazi, P Schuddinck, D Jang, D Yakimets, P Debacker, ... 2016 IEEE International Electron Devices Meeting (IEDM), 28.2. 1-28.2. 4, 2016 | 82 | 2016 |
Enablement of STT-MRAM as last level cache for the high performance computing domain at the 5nm node S Sakhare, M Perumkunnil, TH Bao, S Rao, W Kim, D Crotti, F Yasin, ... 2018 IEEE International Electron Devices Meeting (IEDM), 18.3. 1-18.3. 4, 2018 | 76 | 2018 |
The impact of sequential-3D integration on semiconductor scaling roadmap A Mallik, A Vandooren, L Witters, A Walke, J Franco, Y Sherazi, P Weckx, ... 2017 IEEE International Electron Devices Meeting (IEDM), 32.1. 1-31.1. 4, 2017 | 61 | 2017 |
Device-, circuit-& block-level evaluation of CFET in a 4 track library P Schuddinck, O Zografos, P Weckx, P Matagne, S Sarkar, Y Sherazi, ... 2019 Symposium on VLSI Technology, T204-T205, 2019 | 59 | 2019 |
Vertical device architecture for 5nm and beyond: device & circuit implications AVY Thean, D Yakimets, TH Bao, P Schuddinck, S Sakhare, MG Bardon, ... 2015 Symposium on VLSI Technology (VLSI Technology), T26-T27, 2015 | 59 | 2015 |
Stacked nanosheet fork architecture for SRAM design and device co-optimization toward 3nm P Weckx, J Ryckaert, V Putcha, A De Keersgieter, J Boemmels, ... 2017 IEEE International Electron Devices Meeting (IEDM), 20.5. 1-20.5. 4, 2017 | 58 | 2017 |
Power-performance trade-offs for lateral nanosheets on ultra-scaled standard cells MG Bardon, Y Sherazi, D Jang, D Yakimets, P Schuddinck, R Baert, ... 2018 IEEE Symposium on VLSI Technology, 143-144, 2018 | 56 | 2018 |
Vertical nanowire FET integration and device aspects A Veloso, E Altamirano-Sánchez, S Brus, BT Chan, M Cupak, M Dehan, ... ECS Transactions 72 (4), 31, 2016 | 56 | 2016 |
Holisitic device exploration for 7nm node P Raghavan, MG Bardon, D Jang, P Schuddinck, D Yakimets, J Ryckaert, ... 2015 IEEE Custom Integrated Circuits Conference (CICC), 1-5, 2015 | 52 | 2015 |
Technology/system codesign and benchmarking for lateral and vertical GAA nanowire FETs at 5-nm technology node C Pan, P Raghavan, D Yakimets, P Debacker, F Catthoor, N Collaert, ... IEEE Transactions on Electron Devices 62 (10), 3125-3132, 2015 | 49 | 2015 |
Dimensioning for power and performance under 10nm: The limits of FinFETs scaling MG Bardon, P Schuddinck, P Raghavan, D Jang, D Yakimets, A Mercha, ... 2015 International Conference on IC Design & Technology (ICICDT), 1-4, 2015 | 49 | 2015 |
Circuit and process co-design with vertical gate-all-around nanowire FET technology to extend CMOS scaling for 5nm and beyond technologies TH Bao, D Yakimets, J Ryckaert, I Ciofi, R Baert, A Veloso, J Boemmels, ... 2014 44th European Solid State Device Research Conference (ESSDERC), 102-105, 2014 | 48 | 2014 |
Layout-induced stress effects in 14nm & 10nm FinFETs and their impact on performance MG Bardon, V Moroz, G Eneman, P Schuddinck, M Dehan, D Yakimets, ... 2013 Symposium on VLSI Technology, T114-T115, 2013 | 43 | 2013 |
Buried power rail integration with FinFETs for ultimate CMOS scaling A Gupta, OV Pedreira, G Arutchelvan, H Zahedmanesh, K Devriendt, ... IEEE Transactions on Electron Devices 67 (12), 5349-5354, 2020 | 40 | 2020 |