| The role of side-branching in microstructure development in laser powder-bed fusion MS Pham, B Dovgyy, PA Hooper, CM Gourlay, A Piglione Nature communications 11 (1), 749, 2020 | 363 | 2020 |
| Dilatant shear bands in solidifying metals CM Gourlay, AK Dahle Nature 445 (7123), 70-73, 2007 | 253 | 2007 |
| Printability and microstructure of the CoCrFeMnNi high-entropy alloy fabricated by laser powder bed fusion A Piglione, B Dovgyy, C Liu, CM Gourlay, PA Hooper, MS Pham Materials Letters 224, 22-25, 2018 | 173 | 2018 |
| Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates K Nogita, CM Gourlay, T Nishimura Jom 61, 45-51, 2009 | 159 | 2009 |
| Defect band characteristics in Mg-Al and Al-Si high-pressure die castings CM Gourlay, HI Laukli, AK Dahle Metallurgical and Materials Transactions A 38, 1833-1844, 2007 | 153 | 2007 |
| Microstructure formation in AlSi4MgMn and AlMg5Si2Mn high-pressure die castings S Otarawanna, CM Gourlay, HI Laukli, AK Dahle Metallurgical and Materials Transactions A 40, 1645-1659, 2009 | 131 | 2009 |
| Migration of crystals during the filling of semi-solid castings HI Laukli, CM Gourlay, AK Dahle Metallurgical and Materials Transactions A 36, 805-818, 2005 | 123 | 2005 |
| Revealing the micromechanisms behind semi-solid metal deformation with time-resolved X-ray tomography KM Kareh, PD Lee, RC Atwood, T Connolley, CM Gourlay Nature communications 5 (1), 4464, 2014 | 107 | 2014 |
| Granular deformation mechanisms in semi-solid alloys CM Gourlay, AK Dahle, T Nagira, N Nakatsuka, K Nogita, K Uesugi, ... Acta Materialia 59 (12), 4933-4943, 2011 | 101 | 2011 |
| Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections JW Xian, SA Belyakov, M Ollivier, K Nogita, H Yasuda, CM Gourlay Acta Materialia 126, 540-551, 2017 | 100 | 2017 |
| Direct observation of deformation in semi-solid carbon steel T Nagira, CM Gourlay, A Sugiyama, M Uesugi, Y Kanzawa, M Yoshiya, ... Scripta Materialia 64 (12), 1129-1132, 2011 | 93 | 2011 |
| The Influence of 0–0.1 wt.% Ni on the Microstructure and Fluidity Length of Sn-0.7Cu-xNi T Ventura, CM Gourlay, K Nogita, T Nishimura, M Rappaz, AK Dahle Journal of Electronic Materials 37, 32-39, 2008 | 90 | 2008 |
| Effects of cobalt on the nucleation and grain refinement of Sn-3Ag-0.5 Cu solders ZL Ma, SA Belyakov, CM Gourlay Journal of Alloys and Compounds 682, 326-337, 2016 | 87 | 2016 |
| Kinetics of the η–η′ transformation in Cu6Sn5 K Nogita, CM Gourlay, SD McDonald, YQ Wu, J Read, QF Gu Scripta Materialia 65 (10), 922-925, 2011 | 86 | 2011 |
| Evidence of the hydrogen release mechanism in bulk MgH2 K Nogita, XQ Tran, T Yamamoto, E Tanaka, SD McDonald, CM Gourlay, ... Scientific reports 5 (1), 8450, 2015 | 80 | 2015 |
| Nucleation of tin on the Cu6Sn5 layer in electronic interconnections JW Xian, ZL Ma, SA Belyakov, M Ollivier, CM Gourlay Acta Materialia 123, 404-415, 2017 | 76 | 2017 |
| Engineering the Mg–Mg2Ni eutectic transformation to produce improved hydrogen storage alloys K Nogita, S Ockert, J Pierce, MC Greaves, CM Gourlay, AK Dahle International Journal of Hydrogen Energy 34 (18), 7686-7691, 2009 | 73 | 2009 |
| The influence of Ni additions on the relative stability of η and η′ Cu6Sn5 U Schwingenschlögl, C Di Paola, K Nogita, CM Gourlay Applied Physics Letters 96 (6), 2010 | 72 | 2010 |
| In situ investigation of unidirectional solidification in Sn–0.7 Cu and Sn–0.7 Cu–0.06 Ni CM Gourlay, K Nogita, AK Dahle, Y Yamamoto, K Uesugi, T Nagira, ... Acta Materialia 59 (10), 4043-4054, 2011 | 71 | 2011 |
| Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles MAAM Salleh, SD McDonald, CM Gourlay, H Yasuda, K Nogita Materials & Design 108, 418-428, 2016 | 70 | 2016 |
Sergey BelyakovTokamakenergy, UK在 tokamakenergy.co.uk 的电子邮件经过验证
