| A 0.65 THz focal-plane array in a quarter-micron CMOS process technology E Ojefors, UR Pfeiffer, A Lisauskas, HG Roskos IEEE Journal of Solid-State Circuits 44 (7), 1968-1976, 2009 | 516 | 2009 |
| A 1 k-pixel video camera for 0.7–1.1 terahertz imaging applications in 65-nm CMOS R Al Hadi, H Sherry, J Grzyb, Y Zhao, W Forster, HM Keller, A Cathelin, ... IEEE Journal of Solid-State Circuits 47 (12), 2999-3012, 2012 | 470 | 2012 |
| Advanced millimeter-wave technologies: antennas, packaging and circuits D Liu, U Pfeiffer, J Grzyb, B Gaucher John Wiley & Sons, 2009 | 460 | 2009 |
| A silicon 60-GHz receiver and transmitter chipset for broadband communications SK Reynolds, BA Floyd, UR Pfeiffer, T Beukema, J Grzyb, C Haymes, ... IEEE Journal of Solid-State Circuits 41 (12), 2820-2831, 2006 | 411 | 2006 |
| Rational design of high-responsivity detectors of terahertz radiation based on distributed self-mixing in silicon field-effect transistors A Lisauskas, U Pfeiffer, E Öjefors, PH Bolìvar, D Glaab, HG Roskos Journal of Applied Physics 105 (11), 2009 | 388 | 2009 |
| SiGe bipolar transceiver circuits operating at 60 GHz BA Floyd, SK Reynolds, UR Pfeiffer, T Zwick, T Beukema, B Gaucher IEEE journal of solid-state circuits 40 (1), 156-167, 2005 | 385 | 2005 |
| Terahertz imaging and sensing applications with silicon-based technologies P Hillger, J Grzyb, R Jain, UR Pfeiffer IEEE Transactions on Terahertz Science and Technology 9 (1), 1-19, 2018 | 341 | 2018 |
| Apparatus and methods for constructing antennas using wire bonds as radiating elements BP Gaucher, D Liu, URR Pfeiffer, TM Zwick US Patent 7,295,161, 2007 | 247 | 2007 |
| A chip-scale packaging technology for 60-GHz wireless chipsets UR Pfeiffer, J Grzyb, D Liu, B Gaucher, T Beukema, BA Floyd, ... IEEE Transactions on Microwave Theory and Techniques 54 (8), 3387-3397, 2006 | 213 | 2006 |
| A 20 dBm fully-integrated 60 GHz SiGe power amplifier with automatic level control UR Pfeiffer, D Goren IEEE Journal of Solid-State Circuits 42 (7), 1455-1463, 2007 | 205 | 2007 |
| A silicon 60GHz receiver and transmitter chipset for broadband communications B Floyd, S Reynolds, U Pfeifer, T Beukema, J Grzyb, C Haymes 2006 IEEE International Solid State Circuits Conference-Digest of Technical …, 2006 | 204 | 2006 |
| Active 220-and 325-GHz frequency multiplier chains in an SiGe HBT technology E Öjefors, B Heinemann, UR Pfeiffer IEEE Transactions on microwave theory and techniques 59 (5), 1311-1318, 2011 | 201 | 2011 |
| A fully integrated 240-GHz direct-conversion quadrature transmitter and receiver chipset in SiGe technology N Sarmah, J Grzyb, K Statnikov, S Malz, PR Vazquez, W Föerster, ... IEEE Transactions on Microwave Theory and Techniques 64 (2), 562-574, 2015 | 187 | 2015 |
| A 16-QAM 100-Gb/s 1-M wireless link with an EVM of 17% at 230 GHz in an SiGe technology P Rodríguez-Vázquez, J Grzyb, B Heinemann, UR Pfeiffer IEEE Microwave and Wireless Components Letters 29 (4), 297-299, 2019 | 180 | 2019 |
| 60GHz transceiver circuits in SiGe bipolar technology S Reynolds, B Floyd, U Pfeiffer, T Zwick 2004 IEEE International Solid-State Circuits Conference (IEEE Cat. No …, 2004 | 177 | 2004 |
| Subharmonic 220-and 320-GHz SiGe HBT receiver front-ends E Ojefors, B Heinemann, UR Pfeiffer IEEE Transactions on Microwave Theory and Techniques 60 (5), 1397-1404, 2012 | 175 | 2012 |
| Apparatus and method for constructing and packaging printed antenna devices BP Gaucher, D Liu, URR Pfeiffer, TM Zwick US Patent 7,119,745, 2006 | 169 | 2006 |
| Apparatus and methods for packaging integrated circuit chips with antenna modules providing closed electromagnetic environment for integrated antennas BP Gaucher, J Grzyb, D Liu, UR Pfeiffer US Patent 7,372,408, 2008 | 162 | 2008 |
| A 288-GHz lens-integrated balanced triple-push source in a 65-nm CMOS technology J Grzyb, Y Zhao, UR Pfeiffer IEEE Journal of Solid-State Circuits 48 (7), 1751-1761, 2013 | 161 | 2013 |
| A 820GHz SiGe chipset for terahertz active imaging applications E Öjefors, J Grzyb, Y Zhao, B Heinemann, B Tillack, UR Pfeiffer 2011 IEEE International Solid-State Circuits Conference, 224-226, 2011 | 155 | 2011 |
