| A comparative study of energy savings in a liquid-cooled server by dynamic control of coolant flow rate at server level P Shahi, S Saini, P Bansode, D Agonafer IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 33 | 2021 |
| Air flow pattern and path flow simulation of airborne particulate contaminants in a high-density data center utilizing airside economization G Thirunavakkarasu, S Saini, J Shah, D Agonafer International electronic packaging technical conference and exhibition 51920 …, 2018 | 32 | 2018 |
| Development of a technique to measure deliquescent relative humidity of particulate contaminants and determination of the operating relative humidity of a data center JM Shah, R Anand, S Saini, R Cyriac, D Agonafer, P Singh, M Kaler International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019 | 31 | 2019 |
| Design, development, and characterization of a flow control device for dynamic cooling of liquid-cooled servers P Shahi, AP Deshmukh, HY Hurnekar, S Saini, P Bansode, R Kasukurthy, ... Journal of Electronic Packaging 144 (4), 041008, 2022 | 30 | 2022 |
| Numerical analysis of oil immersion cooling of a server using mineral oil and Al2O3 nanofluid A Niazmand, P Murthy, S Saini, P Shahi, P Bansode, D Agonafer International Electronic Packaging Technical Conference and Exhibition 84041 …, 2020 | 29 | 2020 |
| CFD analysis on liquid cooled cold plate using copper nanoparticles P Shahi, S Agarwal, S Saini, A Niazmand, P Bansode, D Agonafer International Electronic Packaging Technical Conference and Exhibition 84041 …, 2020 | 26 | 2020 |
| CFD investigation of dispersion of airborne particulate contaminants in a raised floor data center S Saini, P Shahi, P Bansode, A Siddarth, D Agonafer 2020 36th Semiconductor Thermal Measurement, Modeling & Management Symposium …, 2020 | 26 | 2020 |
| CFD simulation of two-phase immersion cooling using FC-72 dielectric fluid A Niazmand, T Chauhan, S Saini, P Shahi, PV Bansode, D Agonafer International Electronic Packaging Technical Conference and Exhibition 84041 …, 2020 | 24 | 2020 |
| Experimental analysis for optimization of thermal performance of a server in single phase immersion cooling PA Shinde, PV Bansode, S Saini, R Kasukurthy, T Chauhan, JM Shah, ... International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019 | 24 | 2019 |
| Computational analysis for thermal optimization of server for single phase immersion cooling D Gandhi, U Chowdhury, T Chauhan, P Bansode, S Saini, JM Shah, ... International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019 | 24 | 2019 |
| Computational Form Factor Study of a 3rd Generation Open Compute Server for Single-Phase Immersion Cooling JM Shah, C Bhatt, P Rachamreddy, R Dandamudi, S Saini, D Agonafer International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019 | 21 | 2019 |
| Airflow path and flow pattern analysis of sub-micron particulate contaminants in a data center with hot aisle containment system utilizing direct air cooling S Saini The University of Texas at Arlington, 2018 | 20 | 2018 |
| Feasibility Study of Rear Door Heat Exchanger for a High Capacity Data Center V Shalom Simon, H Modi, KB Sivaraju, P Bansode, S Saini, P Shahi, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 17 | 2022 |
| CFD Modeling of the Distribution of Airborne Particulate Contaminants Inside Data Center Hardware S Saini, KK Adsul, P Shahi, A Niazmand, P Bansode, D Agonafer International Electronic Packaging Technical Conference and Exhibition 84041 …, 2020 | 16 | 2020 |
| Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review S Saini, JM Shah, P Shahi, P Bansode, D Agonafer, P Singh, R Schmidt, ... Journal of Electronic Packaging 144 (3), 030801, 2022 | 15 | 2022 |
| Assessment of reliability enhancement in high-power CPUs and GPUs using dynamic direct-to-chip liquid cooling P Shahi, A Mathew, S Saini, P Bansode, R Kasukurthy, D Agonafer Journal of Enhanced Heat Transfer 29 (8), 2022 | 15 | 2022 |
| Evaluating the reliability of passive server components for single-phase immersion cooling JM Shah, K Padmanaban, H Singh, S Duraisamy Asokan, S Saini, ... Journal of Electronic Packaging 144 (2), 021109, 2022 | 14 | 2022 |
| Numerical investigation on effect of target coolant delivery in liquid-cooled microchannel heat SINKS P Shahi, A Deshmukh, HY Hurnekar, S Saini, P Bansode, D Agonafer Journal of Enhanced Heat Transfer 30 (1), 2023 | 13 | 2023 |
| Transient CFD Analysis of Dynamic Liquid-Cooling Implementation at Rack Level H Modi, P Shahi, A Sivakumar, S Saini, P Bansode, V Shalom, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 13 | 2022 |
| A Numerical Study on Multi-Objective Design Optimization of Heat Sinks for Forced and Natural Convection Cooling of Immersion-Cooled Servers S Saini, T Wagh, P Bansode, P Shahi, J Herring, J Lamotte-Dawaghreh, ... Journal of Enhanced Heat Transfer 29 (8), 2022 | 13 | 2022 |
Pratik BansodeUniversity of University at Arlington在 mavs.uta.edu 的电子邮件经过验证
