| A state-of-the-art review of fatigue life prediction models for solder joint S Su, FJ Akkara, R Thaper, A Alkhazali, M Hamasha, S Hamasha Journal of Electronic Packaging 141 (4), 040802, 2019 | 87 | 2019 |
| Solder joint reliability in isothermal varying load cycling S Su, F Akkara, A Dawahdeh, P Borgesen, A Qasaimeh 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017 | 46 | 2017 |
| Effect of Cycling Amplitude Variations on SnAgCu Solder Joint Fatigue Life S Hamasha, F Akkara, S Su, H Ali, P Borgesen IEEE Transactions on Components, Packaging and Manufacturing Technology, 2018 | 44 | 2018 |
| Effect of surface finish and high bi solder alloy on component reliability in thermal cycling F Akkara, M Abueed, M Rababah, C Zhao, S Su, J Suhling, J Evans 2018 IEEE 68th electronic components and technology conference (ECTC), 2032-2040, 2018 | 42 | 2018 |
| Fatigue properties of lead-free doped solder joints S Su, FJ Akkara, M Abueed, M Jian, J Suhling, P Lall 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 40 | 2018 |
| Effect of Long-Term Room Temperature Aging on the Fatigue Properties of SnAgCu Solder Joint S Su, N Fu, S Akkara, Francy John, Hamasha Journal of Electronic Packaging 140 (3), 031005, 2018 | 36 | 2018 |
| Effect of solder sphere alloys and surface finishes on the reliability of lead-free solder joints in accelerated thermal cycling FJ Akkara, C Zhao, R Athamenh, S Su, M Abueed, S Hamasha, J Suhling, ... 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 28 | 2018 |
| Effects of surface finish on the shear fatigue of SAC-based solder alloys S Su, M Jian IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2019 | 23 | 2019 |
| Effect of aging on the fatigue life and shear strength of SAC305 solder joints in actual setting conditions R Al Athamneh, M Abueed, DB Hani, S Su, J Suhling, P Lall 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 23 | 2019 |
| Effect of surface finish on the shear properties of SnAgCu-based solder alloys S Su, K Hamasha IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (8 …, 2019 | 22 | 2019 |
| EFFECTS OF LONG-TERM AGING ON SnAgCu SOLDER JOINTS RELIABILITY IN MECHANICAL CYCLING FATIGUE FJ Akkara, S Su, S Thirugnanasambandam, A Dawahdeh, ... SMTA International, 419-425, 2017 | 21 | 2017 |
| Fatigue properties and microstructure of SnAgCu Bi-based solder joint M Jian, S Su, S Hamasha, MM Hamasha, A Alkhazali Journal of Electronic Packaging 143 (1), 011008, 2021 | 19 | 2021 |
| Fatigue and Shear Properties of High Reliable Solder Joints for Harsh Applications S Sinan, J Minghong, JA Francy, H Sa’d, S Jeff, L Pradeep SMTA International 2018, 2018 | 17 | 2018 |
| Mechanical properties and microstructural fatigue damage evolution in cyclically loaded lead-free solder joints S Su, MA Hoque, MM Chowdhury, JC Suhling, JL Evans, P Lall 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 792-799, 2019 | 15 | 2019 |
| Effect of surface finish on the fatigue behavior of Bi-based solder joints S Su, M Jian, X Wei, FJ Akkara, J Suhling, P Lall 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 14 | 2019 |
| Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes on The Component Reliability in Harsh Thermal Cycling JA Francy, S Sinan, Z Cong, H Sa’d, S Jeffrey, L Pradeep SMTA International 2018, 2018 | 14 | 2018 |
| Reliability of micro-alloyed SnAgCu based solder interconnections for various harsh applications S Su, FJ Akkara, A Raj, C Zhao, S Gordon, S Sridhar, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2309-2317, 2019 | 12 | 2019 |
| Fatigue performance of doped SAC solder joints in BGA assembly X Wei, S Su, H Ali, J Suhling, P Lall 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 11 | 2020 |
| Effect of Aging on Component Reliability in Harsh Thermal Cycling FJ Akkara, C Zhao, S Gordon, S Su, M Abueed, J Suhling, P Lall 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 8 | 2019 |
| Thermal cycling reliability of newly developed lead-free solders for harsh environments FJ Akkara, C Zhao, S Ahmed, M Abueed, S Su, SD Hamasha, J Suhling, ... Proc. SMTA Int, 2019 | 6 | 2019 |
Francy John AkkaraPh.D. Candidate在 auburn.edu 的电子邮件经过验证
