| Low power systems for wireless microsensors K Bult, A Burstein, D Chang, M Dong, M Fielding, E Kruglick, J Ho, F Lin, ... Proceedings of 1996 International Symposium on Low Power Electronics and …, 1996 | 217 | 1996 |
| Lateral MEMS microcontact considerations EJJ Kruglick, KSJ Pister Journal of Microelectromechanical Systems 8 (3), 264-271, 1999 | 159 | 1999 |
| Surface-micromachined components for articulated microrobots R Yeh, EJJ Kruglick, KSJ Pister Journal of Microelectromechanical systems 5 (1), 10-17, 1996 | 144 | 1996 |
| Gas-phase silicon micromachining with xenon difluoride FI Chang, R Yeh, G Lin, PB Chu, EG Hoffman, EJ Kruglick, KSJ Pister, ... Microelectronic structures and microelectromechanical devices for optical …, 1995 | 141 | 1995 |
| Cantilever microprobes for contacting electronic components and methods for making such probes RT Chen, EJJ Kruglick, CA Bang, DR Smalley, PB Lembrikov US Patent 7,265,565, 2007 | 98 | 2007 |
| Modular three-dimensional optical switch J Ma, EJJ Kruglick, DJ Reiley, PJ Marchand, S Gloeckner US Patent 6,567,574, 2003 | 95 | 2003 |
| BISTABLE MS RELAYS AND CONTACT CHARACTERIZATION E Kruglick, KS Pister | 82 | 1998 |
| MEMS device with two axes comb drive actuators J Gritters, CA Bang, E Klaassen, L Fan, R Chen, H Yeh, EJJ Kruglick US Patent 7,872,394, 2011 | 78 | 2011 |
| 3D structures with piezoresistive sensors in standard CMOS E Hoffman, B Warneke, E Kruglick, J Weigold, KSJ Pister Proceedings IEEE Micro Electro Mechanical Systems. 1995, 288, 1995 | 69 | 1995 |
| Wireless integrated microsensors K Bult, A Burstein, D Chang, M Dong, M Fielding, E Kruglick, J Ho, F Lin, ... Proc. of Conference on Sensors and Systems (Sensors Expo), 33-38, 1996 | 68 | 1996 |
| Digital MEMS switch for planar photonic crossconnects L Fan, S Gloeckner, PD Dobblelaere, S Patra, D Reiley, C King, T Yeh, ... Optical Fiber Communication Conference, TuO4, 2002 | 54 | 2002 |
| Microelectromechanical components for articulated microrobots R Yeh, EJJ Kruglick, KSJ Pister date of first publication unknown, 1995 | 54 | 1995 |
| Microprobe tips and methods for making K Kim, AL Cohen, WM Larsen, RT Chen, AH Kumar, EJJ Kruglick, V Arat, ... US Patent 7,273,812, 2007 | 50* | 2007 |
| Pin-type probes for contacting electronic circuits and methods for making such probes R Chen, E Kruglick, V Arat, D Feinberg US Patent App. 11/029,180, 2005 | 50 | 2005 |
| Electrochemically fabricated microprobes E Kruglick, C Bang, V Arat, A Cohen, D Smalley, K Kim, R Chen, G Zhang US Patent App. 10/949,738, 2006 | 48 | 2006 |
| A/spl mu/-magnetometer based on electron tunneling LM Miller, JA Podosek, E Kruglick, TW Kenny, JA Kovacich, WJ Kaiser Proceedings of Ninth International Workshop on Micro Electromechanical …, 1996 | 48 | 1996 |
| Datacenter application packages with hardware accelerators E Kruglick US Patent App. 14/234,380, 2014 | 47 | 2014 |
| Method of electrochemically fabricating multilayer structures having improved interlayer adhesion G Zhang, A Cohen, M Lockard, A Kumar, E Kruglick, K Kim US Patent App. 10/841,382, 2005 | 47 | 2005 |
| Probe arrays and method for making AH Kumar, EJJ Kruglick, AL Cohen, K Kim, G Zhang, RT Chen, CA Bang, ... US Patent 7,878,385, 2011 | 44* | 2011 |
| Management of hardware accelerator configurations in a processor chip E Kruglick US Patent App. 14/123,231, 2014 | 42 | 2014 |
Patrick Chu在 alum.mit.edu 的电子邮件经过验证
Patrick Chu在 alum.mit.edu 的电子邮件经过验证