| Ultra-thin embedded semiconductor device package and method of manufacturing thereof AV Gowda, PA McConnelee, SS Chauhan US Patent 9,806,051, 2017 | 173 | 2017 |
| Thermally conductive composition and method for preparing the same H Zhong, S Paisner, A Gowda, D Esler, S Tonapi, J David, P Meneghetti, ... US Patent App. 11/207,865, 2007 | 84 | 2007 |
| Integral micro-channel liquid cooling for power electronics LD Stevanovic, RA Beaupre, AV Gowda, AG Pautsch, SA Solovitz 2010 Twenty-Fifth Annual IEEE Applied Power Electronics Conference and …, 2010 | 67 | 2010 |
| Double side cooled power module with power overlay RA Beaupre, AV Gowda, LD jub Stevanovic, SA Solovitz US Patent 8,358,000, 2013 | 64 | 2013 |
| Low inductance power module with blade connector LD Stevanovic, RA Beaupre, EC Delgado, AV Gowda 2010 Twenty-Fifth Annual IEEE Applied Power Electronics Conference and …, 2010 | 63 | 2010 |
| Three-dimensional stacked integrated circuit devices and methods of assembling the same AV Gowda US Patent 10,068,879, 2018 | 58 | 2018 |
| Reliability testing of silicone-based thermal greases [IC cooling applications] A Gowda, D Esler, SN Paisner, S Tonapi, K Nagarkar, K Srihari Semiconductor Thermal Measurement and Management IEEE Twenty First Annual …, 2005 | 54 | 2005 |
| Thermal transport structure and associated method J Zhang, SS Tonapi, RC Mills, AV Gowda US Patent 7,297,399, 2007 | 53 | 2007 |
| Power overlay structure and method of making same AV Gowda, PA McConnelee, SS Chauhan US Patent 8,987,876, 2015 | 48 | 2015 |
| Sensor package and method K Subramanian, DJ Buckley Jr, S Rubinsztajn, AV Gowda, SE Weaver Jr, ... US Patent 7,021,147, 2006 | 46 | 2006 |
| Voids in thermal interface material layers and their effect on thermal performance A Gowda, D Esler, S Tonapi, K Nagarkar, K Srihari Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004 …, 2004 | 45 | 2004 |
| Embedded semiconductor device package and method of manufacturing thereof SS Chauhan, PA McConnelee, AV Gowda US Patent 9,391,027, 2016 | 44 | 2016 |
| Embedded semiconductor device package and method of manufacturing thereof SS Chauhan, PA McConnelee, AV Gowda US Patent 9,209,151, 2015 | 41 | 2015 |
| Power overlay structure and method of making same AV Gowda, PA McConnelee, SS Chauhan US Patent App. 15/601,735, 2017 | 39 | 2017 |
| 1.2 kV class SiC MOSFETs with improved performance over wide operating temperature P Losee, A Bolotnikov, L Yu, R Beaupre, Z Stum, S Kennerly, G Dunne, ... 2014 IEEE 26th International Symposium on Power Semiconductor Devices & IC's …, 2014 | 38 | 2014 |
| SiC MOSFET design considerations for reliable high voltage operation PA Losee, A Bolotnikov, LC Yu, G Dunne, D Esler, J Erlbaum, B Rowden, ... 2017 IEEE International Reliability Physics Symposium (IRPS), 2A-2.1-2A-2.8, 2017 | 37 | 2017 |
| Method for making electronic devices A Gowda, S Tonapi, R Mills, D Esler, S Latham, J Campbell US Patent App. 11/146,838, 2006 | 35 | 2006 |
| Power overlay structure and method of making same AV Gowda, PA McConnelee, SS Chauhan US Patent 10,269,688, 2019 | 32 | 2019 |
| Thermal transport structure J Zhang, S Tonapi, A Gowda, R Mills US Patent App. 11/782,049, 2008 | 32 | 2008 |
| Thin bond-line silicone adhesive composition and method for preparing the same S Tonapi, H Zhong, F Schattenmann, J David, K Saville, A Gowda, D Esler, ... US Patent App. 11/062,040, 2005 | 31 | 2005 |
