| No-flow underfill: Effect of chip placement speed on the void formation using numerical method MN Nashrudin, A Abas, MZ Abdullah, MYT Ali, Z Samsudin, I Mansor Microelectronics Journal 114, 105139, 2021 | 5 | 2021 |
| Screen-Printed Nickel–Zinc Batteries: A Review of Additive Manufacturing and Evaluation Methods MA Nazri, LM Lim, Z Samsudin, MYT Ali, I Mansor, MI Suhaimi, ... 3D Printing and Additive Manufacturing 8 (3), 176-192, 2021 | 4 | 2021 |
| Dual band circular patch flexible wearable antenna design for sub-6 GHz 5G applications S Afroz, AA Al-Hadi, SN Azemi, WF Hoon, S Padmanathan, CMNC Isa, ... 2022 IEEE International RF and Microwave Conference (RFM), 1-4, 2022 | 3 | 2022 |
| Compact Wideband Wearable Antipodal Vivaldi Antenna for 5G Applications BC Sahoo, AA Al-Hadi, SN Azemi, WF Hoon, S Padmanathan, CMNC Isa, ... 2022 IEEE International RF and Microwave Conference (RFM), 1-4, 2022 | 2 | 2022 |
| Fabrication of a Wearable Antenna with Defected Ground Structure on a Flexible TPU-Polyester Substrate BM Mohammed, AA Al-Hadi, SN Azemi, LY Seng, WF Hoon, Y San Loh, ... 2022 IEEE International RF and Microwave Conference (RFM), 1-4, 2022 | 1 | 2022 |
| Fabrication and characterization of printed zinc batteries MA Nazri, AN Nordin, LM Lim, MYT Ali, I Mansor, MI Suhaimi, R Othman, ... Bulletin of Electrical Engineering and Informatics 10 (3), 1173-1182, 2021 | 1 | 2021 |
| Method and Apparatus for Stacking Printed Circuit Board Assemblies with Single Reflow ZB Samsudin, IB Mansor US Patent App. 16/413,046, 2020 | 1 | 2020 |
| Method and apparatus for stacking printed circuit board assemblies with single reflow ZB Samsudin, IB Mansor US Patent App. 18/245,024, 2023 | | 2023 |
| A 3.5 GHz Wearable Antipodal Vivaldi Antenna for 5G Applications S Afroz, AA Al-Hadi, SN Azemi, WF Hoon, S Padmanathan, CMNC Isa, ... 2023 IEEE International Symposium On Antennas And Propagation (ISAP), 1-2, 2023 | | 2023 |
| Compact Full Flexible Vivaldi Antenna for 3.5 GHz Wearable Applications BC Sahoo, AA Al-Hadi, SN Azemi, WF Hoon, S Padmanathan, CMNC Isa, ... 2023 IEEE International Symposium On Antennas And Propagation (ISAP), 1-2, 2023 | | 2023 |
| QUAD FLAT NO-LEAD PACKAGE WITH DIFFERENT THERMAL PROFILES AND SOLDER PAD FINISHING FOR VOID MINIMIZATION MS Mahyuddin, MZ Abdullah, Z Samsudin, I Mansor, LM Lim, MYT Ali, ... Jurnal Teknologi 84 (6-2), 65-75, 2022 | | 2022 |
| PACKAGE-ON-PACKAGE (POP) UNDERFILL PROCESS USING A MATERIAL DAM METHOD MYT Ali, CY Khor, AI Azmi, MZ Abdullah, Z Samsudin, I Mansor, ... ASEAN Engineering Journal 12 (2), 205-210, 2022 | | 2022 |
Zambri SamsudinSr. Advanced Technolgy Manager, Jabil Inc.在 jabil.com 的电子邮件经过验证
