| Drop impact reliability testing for lead-free and lead-based soldered IC packages DYR Chong, FX Che, JHL Pang, K Ng, JYN Tan, PTH Low Microelectronics reliability 46 (7), 1160-1171, 2006 | 218 | 2006 |
| Thermal cycling analysis of flip-chip solder joint reliability JHL Pang, DYR Chong, TH Low IEEE Transactions on components and packaging technologies 24 (4), 705-712, 2001 | 212 | 2001 |
| Analysis of bone–prosthesis interface micromotion for cementless tibial prosthesis fixation and the influence of loading conditions DYR Chong, UN Hansen, AA Amis Journal of biomechanics 43 (6), 1074-1080, 2010 | 122 | 2010 |
| Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA models JHL Pang, DYR Chong IEEE Transactions on Advanced Packaging 24 (4), 499-506, 2001 | 120 | 2001 |
| Mechanical characterization in failure strength of silicon dice DYR Chong, WE Lee, BK Lim, JHL Pang, TH Low The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2004 | 82 | 2004 |
| Medial longitudinal arch biomechanics evaluation during gait in subjects with flexible flatfoot T Prachgosin, DYR Chong, W Leelasamran, P Smithmaitrie, S Chatpun Acta of bioengineering and biomechanics 17 (4), 121--130, 2015 | 74 | 2015 |
| The influence of tibial component fixation techniques on resorption of supporting bone stock after total knee replacement DYR Chong, UN Hansen, R Van der Venne, N Verdonschot, AA Amis Journal of Biomechanics 44 (5), 948-954, 2011 | 74 | 2011 |
| Finite element analysis of bone and implant stresses for customized 3D-printed orthopaedic implants in fracture fixation L Yan, JL Lim, JW Lee, CSH Tia, GK O’Neill, DYR Chong Medical & biological engineering & computing 58, 921-931, 2020 | 43 | 2020 |
| The influence of bilateral sagittal split ramus osteotomy on the stress distributions in the temporomandibular joints of the patients with facial asymmetry under symmetric … JH Shu, J Yao, YL Zhang, DYR Chong, Z Liu Medicine 97 (25), e11204, 2018 | 40 | 2018 |
| Drop test reliability assessment of leaded & lead-free solder joints for IC packages DYR Chong, K Ng, JYN Tan, PTH Low, JHL Pang, FX Che Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004 …, 2004 | 34 | 2004 |
| Biomechanical behaviour of temporomandibular joints during opening and closing of the mouth: a 3D finite element analysis J Shu, H Ma, L Jia, H Fang, DYR Chong, T Zheng, J Yao, Z Liu International Journal for Numerical Methods in Biomedical Engineering 36 (8 …, 2020 | 33 | 2020 |
| Development of a new improved high performance flip chip BGA package DYR Chong, BK Lim, KJ Rebibis, SJ Pan, S Krishnamoorthi, R Kapoor, ... 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004 | 30 | 2004 |
| Evaluation on influencing factors of board-level drop reliability for chip scale packages (fine-pitch ball grid array) DYR Chong, FX Che, JHL Pang, L Xu, BS Xiong, HJ Toh, BK Lim IEEE Transactions on Advanced Packaging 31 (1), 66-75, 2008 | 27 | 2008 |
| Performance assessment on board-level drop reliability for chip scale packages (fine-pitch BGA) DYR Chong, FX Che, LH Xu, HJ Toh, JHL Pang, BK Xiong, BK Lim 56th Electronic Components and Technology Conference 2006, 8 pp., 2006 | 27 | 2006 |
| Effects on loads in temporomandibular joints for patients with mandibular asymmetry before and after orthognathic surgeries under the unilateral molar clenching J Shu, Y Zhang, DYR Chong, Z Liu Biomechanics and modeling in mechanobiology 19, 533-541, 2020 | 24 | 2020 |
| Analysis of underfill encapsulation curing deformations on flip chip on board (FCOB) package reliability JHL Pang, TI Tan, YR Chong, GY Lim, CL Wong Journal of Electronics Manufacturing 8 (03n04), 181-191, 1998 | 24 | 1998 |
| The influence of tibial prosthesis design features on stresses related to aseptic loosening and stress shielding DYR Chong, UN Hansen, AA Amis Journal of Mechanics in Medicine and Biology 11 (01), 55-72, 2011 | 22 | 2011 |
| Drop reliability performance assessment for PCB assemblies of chip scale packages (CSP) DYR Chong, HJ Toh, BK Lim, PTH Low, JHL Pang, FX Che, BS Xiong, ... 2005 7th Electronic Packaging Technology Conference 1, 8 pp., 2005 | 21 | 2005 |
| Reliability assessment of a high performance flip-chip BGA package (organic substrate based) using finite element analysis DYR Chong, R Kapoor, AYS Sun TC 1, 4s-1, 2003 | 20 | 2003 |
| A biomechanical study of proximal tibia bone grafting through the lateral approach CT Lim, DQK Ng, KJ Tan, AK Ramruttun, W Wang, DYR Chong Injury 47 (11), 2407-2414, 2016 | 19 | 2016 |
