| Additive Manufacturing of 3D‐Architected Multifunctional Metal Oxides DW Yee, ML Lifson, BW Edwards, JR Greer Advanced Materials 31 (33), 1901345, 2019 | 97 | 2019 |
| Enabling Simultaneous Extreme Ultra Low-k in Stiff, Resilient, and Thermally Stable Nano-Architected Materials ML Lifson, MW Kim, JR Greer, BJ Kim Nano letters 17 (12), 7737-7743, 2017 | 32 | 2017 |
| Diameter and location control of ZnO nanowires using electrodeposition and sodium citrate ML Lifson, CG Levey, UJ Gibson Applied Physics A 113 (1), 243-247, 2013 | 13 | 2013 |
| Integrated circuit heat dissipation using nanostructures AB Botula, ML Lifson, JA Slinkman, TG Van Kessel, RL Wolf US Patent 9,324,628, 2016 | 10 | 2016 |
| Centering substrates on a chuck SA Adderly, SD DiStefano, JP Gambino, MG Levy, ML Lifson, MD Moon, ... US Patent 10,224,225, 2019 | 8 | 2019 |
| Apparatus and Method for Centering Substrates on a Chuck SA Adderly, SD Distefano, JP Gambino, MG Levy, ML Lifson, MD Moon, ... US Patent 20,150,235,881, 2015 | 8 | 2015 |
| Recoverable Electrical Breakdown Strength and Dielectric Constant in Ultralow-k Nanolattice Capacitors MW Kim, ML Lifson, GA Rebecca, JR Greer, BJ Kim Nano letters 19 (8), 5689-5696, 2019 | 7 | 2019 |
| METHOD AND APPARATUS FOR DETECTING FOREIGN MATERIAL ON A CHUCK SA Adderly, SD Distefano, JP Gambino, MG Levy, ML Lifson, JH Rankin, ... US Patent 20,150,219,479, 2015 | 6 | 2015 |
| Enabling Durable Ultralow‐k capacitors with Enhanced Breakdown Strength in Density‐Variant Nanolattices MW Kim, ML Lifson, R Gallivan, JR Greer, BJ Kim Advanced Materials, 2208409, 2022 | 5 | 2022 |
| Integrated circuit heat dissipation using nanostructures AB Botula, ML Lifson, JA Slinkman, TG Van Kessel, RL Wolf US Patent 10,068,827, 2018 | 5 | 2018 |
| UNIFORM ROUGHNESS ON BACKSIDE OF A WAFER SA Adderly, JP Gambino, ML Lifson, MD Moon, WJ Murphy, TD Sullivan, ... US Patent 20,150,021,743, 2015 | 5 | 2015 |
| Electromechanical Properties of 3D Multifunctional Nano-Architected Materials ML Lifson California Institute of Technology, 2019 | 4 | 2019 |
| Integrated circuit heat dissipation using nanostructures AB Botula, ML Lifson, JA Slinkman, TG Van Kessel, RL Wolf US Patent 10,109,553, 2018 | 3 | 2018 |
| Integrated circuit heat dissipation using nanostructures AB Botula, ML Lifson, JA Slinkman, TG Van Kessel, RL Wolf US Patent 10,629,710, 2020 | 2 | 2020 |
| Integrated circuit heat dissipation using nanostructures AB Botula, ML Lifson, JA Slinkman, TG Van Kessel, RL Wolf US Patent 10,600,893, 2020 | 2 | 2020 |
| Integrated circuit heat dissipation using nanostructures AB Botula, ML Lifson, JA Slinkman, TG Van Kessel, RL Wolf US Patent 9,666,701, 2017 | 2 | 2017 |
| TSV WAFER WITH IMPROVED FRACTURE STRENGTH JW Adkisson, Y Amoah, JP Gambino, CA Leggett, ML Lifson, CF Musante, ... US Patent 20,150,348,876, 2015 | 2* | 2015 |
| TSV WAFER FRACTURE STRENGTH JW Adkisson, Y Amoah, JP Gambino, CA Leggett, ML Lifson, CF Musante, ... US Patent 20,150,255,404, 2015 | 2* | 2015 |
| Centering substrates on a chuck SA Adderly, SD DiStefano, JP Gambino, MG Levy, ML Lifson, MD Moon, ... US Patent 9,997,385, 2018 | 1 | 2018 |
| The effect of etch residuals on via reliability SA Adderly, MD Moon, ML Lifson, NW Bowe, JP Gambino, TD Sullivan 2013 IEEE Conference on Reliability Science for Advanced Materials and …, 2013 | 1 | 2013 |
Julia GreerCalifornia Institute of Technology在 caltech.edu 的电子邮件经过验证
