Smooth, All-Solid, Low-Hysteresis, Omniphobic Surfaces with Enhanced Mechanical Durability M Boban, K Golovin, B Tobelmann, O Gupte, JM Mabry, A Tuteja ACS applied materials & interfaces 10 (14), 11406-11413, 2018 | 111 | 2018 |
Fundamentals of device and systems packaging: technologies and applications R Tummala McGraw Hill Professional, 2019 | 20 | 2019 |
A review of low-temperature solders in microelectronics packaging V Jayaram, O Gupte, K Bhangaonkar, C Nair IEEE Transactions on Components, Packaging and Manufacturing Technology 13 …, 2023 | 13 | 2023 |
Innovative Socketable and Surface-Mountable BGA Interconnections O Gupte, K Teoh, R Tummala, G Murtagian, V Smet 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1028-1034, 2019 | 13 | 2019 |
Thermal Aging Reliability of Socketable BGA Packages With Ni–Au-Coated SAC305 Spheres O Gupte, G Murtagian, R Tummala, V Smet IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 9 | 2020 |
Effect of Solder Paste Volume and Reflow Parameters on Solder Paste Wicking and Joint Shear Strength of Ni–Au-Coated Cu Spheres O Gupte, G Murtagian, R Tummala, V Smet IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2019 | 9 | 2019 |
Modeling and Design for System-Level Reliability and Warpage Mitigation of Large 2.5 D Glass BGA Packages V Jayaram, O Gupte, V Smet 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1060-1067, 2022 | 7 | 2022 |
Thermal aging reliability of socketable, surface-modified solder BGAs with and without polymer collars O Gupte, G Murtagian, R Tummala, V Smet 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 512-517, 2020 | 7 | 2020 |
Functionalization of poly (ether sulfone)(PES) and polysulfone (PSF) membrane V Subramanian, O Gupte The Bombay Technologist, 22-26, 2014 | 5 | 2014 |
Effect of latching force on socketed BGA packages with Ni-Au coated solder spheres O Gupte, G Murtagian, R Tummala, V Smet 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2158-2164, 2021 | 3 | 2021 |
Modeling, Design and Demonstration of a Single, Innovative Metallurgical System for Socketable and Surface-Mountable Board-Level Interconnections OD Gupte Georgia Institute of Technology, 2021 | 3 | 2021 |
Solder paste wicking in socketable BGAs O Gupte, V Smet, G Murtagian, R Tummala Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) 2019 (DPC …, 2019 | 3 | 2019 |
Solid-state diffusion studies of lead-free solders on gold and in polymer films O Gupte, G Murtagian, M Kathaperumal, R Tummala, V Smet Journal of Materials Science: Materials in Electronics 33 (10), 7679-7690, 2022 | 2 | 2022 |
ELECTRONIC DEVICE CARRIER STRUCTURES INCLUDING POLYMER LAYERS AS BARRIERS TO SOLID STATE SOLDER DIFFUSION AND METHODS OF FORMING THE SAME O Gupte, V Smet, GR Murtagian US Patent App. 17/664,408, 2022 | | 2022 |
Investigation of Aromatic Voltage Stabilizers for Enhancing High Voltage Stability of Epoxy for Power Electronics J Li, K Mohanalingam, O Gupte, Z Sun, K Moon, C Wong 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2348-2354, 2021 | | 2021 |
Fundamentals of Device and Systems Packaging RR Tummala | | 2019 |