| SWAP: A server-scale communication-aware chiplet-based manycore PIM accelerator H Sharma, SK Mandal, JR Doppa, UY Ogras, PP Pande IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2022 | 12 | 2022 |
| Achieving datacenter-scale performance through chiplet-based manycore architectures H Sharma, SK Mandal, JR Doppa, U Ogras, PP Pande 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE), 1-6, 2023 | 5 | 2023 |
| A Heterogeneous Chiplet Architecture for Accelerating End-to-End Transformer Models H Sharma, P Dhingra, JR Doppa, U Ogras, PP Pande arXiv preprint arXiv:2312.11750, 2023 | 3 | 2023 |
| Florets for Chiplets: Data Flow-aware High-Performance and Energy-efficient Network-on-Interposer for CNN Inference Tasks H Sharma, L Pfromm, RO Topaloglu, JR Doppa, UY Ogras, ... ACM Transactions on Embedded Computing Systems 22 (5s), 1-21, 2023 | 3 | 2023 |
| Science on a stick: An experimental and demonstration platform for learning several physical principles DV Gadre, H Sharma, SD Gadre, S Srivastava American Journal of Physics 91 (2), 116-121, 2023 | 3 | 2023 |
| Dataflow-Aware PIM-Enabled Manycore Architecture for Deep Learning Workloads H Sharma, G Narang, JR Doppa, U Ogras, PP Pande 2024 Design, Automation & Test in Europe Conference & Exhibition (DATE), 1-6, 2024 | 1 | 2024 |
| Thermal Modeling and Management Challenges in Heterogenous Integration: 2.5 D Chiplet Platforms and Beyond J Park, A Kanani, L Pfromm, H Sharma, P Solanki, E Tervo, JR Doppa, ... 2024 IEEE 42nd VLSI Test Symposium (VTS), 1-4, 2024 | | 2024 |
Partha PandeWashington State University在 wsu.edu 的电子邮件经过验证
