| Engineered hybrid cardiac patches with multifunctional electronics for online monitoring and regulation of tissue function R Feiner, L Engel, S Fleischer, M Malki, I Gal, A Shapira, ... Nature materials 15 (6), 679-685, 2016 | 417 | 2016 |
| Electroless deposition of metal films with spray processor Y Shacham-Diamand, V Nguyen, V Dubin US Patent 6,065,424, 2000 | 396 | 2000 |
| Selective and blanket electroless copper deposition for ultralarge scale integration VM Dubin, Y Shacham‐Diamand, B Zhao, PK Vasudev, CH Ting Journal of the Electrochemical Society 144 (3), 898, 1997 | 332 | 1997 |
| Electroless deposition equipment or apparatus and method of performing electroless deposition Y Shacham-Diamand, VM Dubin, CH Ting, B Zhao, PK Vasudev US Patent 5,830,805, 1998 | 308 | 1998 |
| Copper transport in thermal SiO2 Y Shacham‐Diamand, A Dedhia, D Hoffstetter, WG Oldham Journal of the Electrochemical Society 140 (8), 2427, 1993 | 305 | 1993 |
| Electroless copper deposition for ULSI Y Shacham-Diamand, V Dubin, M Angyal Thin Solid Films 262 (1-2), 93-103, 1995 | 302 | 1995 |
| A random access photodiode array for intelligent image capture O Yadid-Pecht, R Ginosar, Y Shacham-Diamand IEEE transactions on electron devices 38 (8), 1772-1780, 1991 | 216 | 1991 |
| Electroplating of amorphous thin films of tungsten/nickel alloys O Younes, L Zhu, Y Rosenberg, Y Shacham-Diamand, E Gileadi Langmuir 17 (26), 8270-8275, 2001 | 208 | 2001 |
| Characterization of channel hot electron injection by the subthreshold slope of NROM/sup TM/device E Lusky, Y Shacham-Diamand, I Bloom, B Eitan IEEE Electron Device Letters 22 (11), 556-558, 2001 | 200 | 2001 |
| Copper electroless deposition technology for ultra-large-scale-integration (ULSI) metallization Y Shacham-Diamand, VM Dubin Microelectronic Engineering 33 (1-4), 47-58, 1997 | 178 | 1997 |
| Integrated electroless metallization for ULSI Y Shacham-Diamand, S Lopatin Electrochimica Acta 44 (21-22), 3639-3649, 1999 | 177 | 1999 |
| 30 years of electroless plating for semiconductor and polymer micro-systems Y Shacham-Diamand, T Osaka, Y Okinaka, A Sugiyama, V Dubin Microelectronic Engineering 132, 35-45, 2015 | 166 | 2015 |
| Characterization of electroless deposited Co (W, P) thin films for encapsulation of copper metallization A Kohn, M Eizenberg, Y Shacham-Diamand, Y Sverdlov Materials Science and Engineering: A 302 (1), 18-25, 2001 | 165 | 2001 |
| Electrons retention model for localized charge in oxide-nitride-oxide (ONO) dielectric E Lusky, Y Shacham-Diamand, I Bloom, B Eitan IEEE Electron Device Letters 23 (9), 556-558, 2002 | 160 | 2002 |
| Copper deposition and thermal stability issues in copper-based metallization for ULSI technology J Li, Y Shacham-Diamand, JW Mayer Materials science reports 9 (1), 1-51, 1992 | 136 | 1992 |
| High aspect ratio quarter-micron electroless copper integrated technology: Invited lecture Y Shacham-Diamand, S Lopatin Microelectronic Engineering 37, 77-88, 1997 | 126 | 1997 |
| Electroless copper deposition using glyoxylic acid as reducing agent for ultralarge scale integration metallization YY Shacham‐Diamand Electrochemical and Solid-State Letters 3 (6), 279, 2000 | 125 | 2000 |
| STM/AFM studies of the evolution of morphology of electroplated Ni/W alloys L Zhu, O Younes, N Ashkenasy, Y Shacham-Diamand, E Gileadi Applied surface science 200 (1-4), 1-14, 2002 | 113 | 2002 |
| Novel integrated electrochemical nano-biochip for toxicity detection in water R Popovtzer, T Neufeld, D Biran, EZ Ron, J Rishpon, ... Nano letters 5 (6), 1023-1027, 2005 | 112 | 2005 |
| Subthreshold slope degradation model for localized-charge-trapping based non-volatile memory devices A Shappir, Y Shacham-Diamand, E Lusky, I Bloom, B Eitan Solid-State Electronics 47 (5), 937-941, 2003 | 112 | 2003 |
Shimshon BelkinInstitute of Life Sciences, Hebrew University of Jerusalem在 mail.huji.ac.il 的电子邮件经过验证
