| Direct observation of stray crystal formation in unidirectional solidification of Sn–Bi alloy by X-ray imaging H Yasuda, I Ohnaka, K Kawasaki, A Sugiyama, T Ohmichi, J Iwane, ... Journal of Crystal Growth 262 (1-4), 645-652, 2004 | 228 | 2004 |
| The role of trace element segregation in the eutectic modification of hypoeutectic Al–Si alloys K Nogita, H Yasuda, M Yoshiya, SD McDonald, K Uesugi, A Takeuchi, ... Journal of Alloys and Compounds 489 (2), 415-420, 2010 | 171 | 2010 |
| The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7 Cu/Cu solder joints G Zeng, SD McDonald, Q Gu, Y Terada, K Uesugi, H Yasuda, K Nogita Acta Materialia 83, 357-371, 2015 | 139 | 2015 |
| Determination of strontium segregation in modified hypoeutectic Al–Si alloy by micro X-ray fluorescence analysis K Nogita, H Yasuda, K Yoshida, K Uesugi, A Takeuchi, Y Suzuki, ... Scripta materialia 55 (9), 787-790, 2006 | 128 | 2006 |
| Effect of magnetic field on solidification in Cu-Pb monotectic alloys H Yasuda, I Ohnaka, O Kawakami, K Ueno, K Kishio ISIJ international 43 (6), 942-949, 2003 | 119 | 2003 |
| Development of X-ray imaging for observing solidification of carbon steels H Yasuda, T Nagira, M Yoshiya, N Nakatsuka, A Sugiyama, K Uesugi, ... ISIJ international 51 (3), 402-408, 2011 | 112 | 2011 |
| Levitation of metallic melt by using the simultaneous imposition of the alternating and the static magnetic fields H Yasuda, I Ohnaka, Y Ninomiya, R Ishii, S Fujita, K Kishio Journal of crystal growth 260 (3-4), 475-485, 2004 | 105 | 2004 |
| Granular deformation mechanisms in semi-solid alloys CM Gourlay, AK Dahle, T Nagira, N Nakatsuka, K Nogita, K Uesugi, ... Acta Materialia 59 (12), 4933-4943, 2011 | 101 | 2011 |
| Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections JW Xian, SA Belyakov, M Ollivier, K Nogita, H Yasuda, CM Gourlay Acta Materialia 126, 540-551, 2017 | 100 | 2017 |
| In situ observation of solidification phenomena in Al–Cu and Fe–Si–Al alloys H Yasuda, Y Yamamoto, N Nakatsuka, M Yoshiya, T Nagira, A Sugiyama, ... International Journal of Cast Metals Research 22 (1-4), 15-21, 2009 | 99 | 2009 |
| Direct observation of deformation in semi-solid carbon steel T Nagira, CM Gourlay, A Sugiyama, M Uesugi, Y Kanzawa, M Yoshiya, ... Scripta Materialia 64 (12), 1129-1132, 2011 | 93 | 2011 |
| Dendrite fragmentation induced by massive-like δ–γ transformation in Fe–C alloys H Yasuda, K Morishita, N Nakatsuka, T Nishimura, M Yoshiya, ... Nature communications 10 (1), 3183, 2019 | 83 | 2019 |
| Coupled growth of unidirectionally solidified Al2O3–YAG eutectic ceramics Y Mizutani, H Yasuda, I Ohnaka, N Maeda, Y Waku Journal of Crystal Growth 244 (3-4), 384-392, 2002 | 83 | 2002 |
| Fabrication of aligned pores in aluminum by electrochemical dissolution of monotectic alloys solidified under a magnetic field H Yasuda, I Ohnaka, S Fujimoto, N Takezawa, A Tsuchiyama, T Nakano, ... Scripta materialia 54 (4), 527-532, 2006 | 76 | 2006 |
| Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces MAAM Salleh, SD McDonald, H Yasuda, A Sugiyama, K Nogita Scripta Materialia 100, 17-20, 2015 | 75 | 2015 |
| In situ investigation of unidirectional solidification in Sn–0.7 Cu and Sn–0.7 Cu–0.06 Ni CM Gourlay, K Nogita, AK Dahle, Y Yamamoto, K Uesugi, T Nagira, ... Acta Materialia 59 (10), 4043-4054, 2011 | 71 | 2011 |
| Selection of eutectic systems in AI2O3–Y2O3 ceramics H Yasuda, I Ohnaka, Y Mizutani, Y Waku Science and Technology of Advanced Materials 2 (1), 67-71, 2001 | 71 | 2001 |
| Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles MAAM Salleh, SD McDonald, CM Gourlay, H Yasuda, K Nogita Materials & Design 108, 418-428, 2016 | 70 | 2016 |
| Formation of banded structure in Pb–Bi peritectic alloys K Tokieda, H Yasuda, I Ohnaka Materials Science and Engineering: A 262 (1-2), 238-245, 1999 | 70 | 1999 |
| Periodic structure during unidirectional solidification for peritectic Cd–Sn alloys H Yasuda, N Notake, K Tokieda, I Ohnaka Journal of Crystal Growth 210 (4), 637-645, 2000 | 69 | 2000 |
