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Daniel Kircher
Daniel Kircher
在 tugraz.at 的电子邮件经过验证
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引用次数
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年份
EMC Analysis of the Inverting Boost/Buck Converter Topology
D Kircher, DJ Pommerenke
Electronics 11 (20), 3388, 2022
62022
Impact of Dual-Tone Interference on an Automotive Smart Power High-Side Switch using Direct Power Injection
D Kircher, F Rosenmayr, B Deutschmann
2023 International Symposium on Electromagnetic Compatibility–EMC Europe, 1-5, 2023
42023
A Method to Measure the Electromagnetic Emission Induced by Electromagnetic Interference of Integrated Circuits
D Kircher, N Czepl, D Zupan, B Deutschmann
2023 Joint Asia-Pacific International Symposium on Electromagnetic …, 2023
32023
Influence of Radio Frequency Interference on the Electromagnetic Emission of Integrated Circuits
D Kircher, B Deutschmann, N Czepl
2022 International Symposium on Electromagnetic Compatibility–EMC Europe …, 2022
32022
Functional Safety Risks of Smart Power Devices due to EMI
B Deutschmann, D Kircher
https://doi. org/10.15488/12553, 201-207, 2022
32022
Framework for developing neural network regression models predicting the influence of EMI on integrated circuits
D Zupan, N Czepl, D Kircher
2022 18th International Conference on Synthesis, Modeling, Analysis and …, 2022
22022
Electromagnetic Immunity of the Overtemperature Protection of Smart Power High Side Switches
D Kircher, C Ionascu, B Deutschmann
2024 International Symposium on Electromagnetic Compatibility–EMC Europe …, 2024
12024
A Novel Method for Testing the Electromagnetic Immunity of the Short Circuit Protection Function of Smart Power Switches
D Kircher, B Deutschmann, H Helldorff
2024 IEEE Joint International Symposium on Electromagnetic Compatibility …, 2024
12024
A modular and scalable system for electromagnetic compatibility testing of integrated circuits
D Kircher, S Profanter, B Deutschmann
e+ i Elektrotechnik und Informationstechnik 141 (1), 47-55, 2024
12024
A modular approach of an electromagnetic compatibility test system for integrated circuits
D Kircher, B Deutschmann, S Profanter
2023 Austrochip Workshop on Microelectronics (Austrochip), 19-22, 2023
12023
Comparison of Simulation and Measurement of EMI-Induced Offset Voltages Occuring at Folded Cascode Operational Amplifiers
N Czepl, D Zupan, D Kircher
2022 Austrochip Workshop on Microelectronics (Austrochip), 53-56, 2022
12022
A Fault Tree Approach Focusing on Electromagnetic Interference
K Hörmaier, H Zangl, D Kircher, B Deutschmann
2021 13th International Workshop on the Electromagnetic Compatibility of …, 2022
12022
EMI Robust Comparator Design for Protection Features of Smart Power Switches
D Kircher, C Ionascu, B Deutschmann
2024 14th International Workshop on the Electromagnetic Compatibility of …, 2024
2024
Investigations on a Predictive Way to Define the Impedance of Conical Inductors-Part 1: Inductor Angle
C Maier, D Kircher, S Profanter
21. EMV-Fachtagung 2024, 2024
2024
Investigations on a Predictive Way to Define the Impedance of Conical Inductors-Part 2: Winding Distance
D Kircher, S Profanter, C Maier
21. EMV-Fachtagung 2024, 2024
2024
Investigations on a Predictive Way to Define the Impedance of Conical Inductors-Part 3: Number of Windings
S Profanter, C Maier, D Kircher
21. EMV-Fachtagung 2024, 2024
2024
Effects of Ionising Radiation on the Electromagnetic Immunity Behaviour of Integrated Circuits
N Czepl, D Kircher, B Deutschmann
2024 IEEE Joint International Symposium on Electromagnetic Compatibility …, 2024
2024
Measurement of Integrated Folded Cascode Amplifier Structures with Different EMI Improved Differential Input Pairs
D Zupan, N Czepl, D Kircher
20. EMV-Fachtagung, 2023
2023
Impact of Radio Frequency Interference on the Electromagnetic Emission of Integrated Circuits
N Czepl, D Kircher, D Zupan
20. EMV-Fachtagung, 2023
2023
EMI Induced Electromagnetic Emission of ICs in non fail states
D Kircher, N Czepl, D Zupan
20. EMV-Fachtagung, 2023
2023
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