| Particle imaging techniques for microfabricated fluidic systems S Devasenathipathy, JG Santiago, ST Wereley, CD Meinhart, K Takehara Experiments in Fluids 34, 504-514, 2003 | 267 | 2003 |
| Experimental observation of induced-charge electro-osmosis around a metal wire in a microchannel JA Levitan, S Devasenathipathy, V Studer, Y Ben, T Thorsen, TM Squires, ... Colloids and Surfaces A: Physicochemical and Engineering Aspects 267 (1-3 …, 2005 | 203 | 2005 |
| Particle tracking techniques for electrokinetic microchannel flows S Devasenathipathy, JG Santiago, K Takehara Analytical chemistry 74 (15), 3704-3713, 2002 | 195 | 2002 |
| Electrokinetic flow diagnostics S Devasenathipathy, JG Santiago Microscale Diagnostic Techniques, 113-154, 2005 | 49 | 2005 |
| Experimental investigation of flow transition in microchannels using micron-resolution particle image velocimetry R Zeighami, D Laser, P Zhou, M Asheghi, S Devasenathipathy, T Kenny, ... ITHERM 2000. The Seventh Intersociety Conference on Thermal and …, 2000 | 43 | 2000 |
| Micro-and nano-scale diagnostic techniques S Devasenathipathy, JG Santiago Springer, New York, 2003 | 37 | 2003 |
| Investigation of internal pressure gradients generated in electrokinetic flows with axial conductivity gradients S Devasenathipathy, R Bharadwaj, JG Santiago Experiments in fluids 43, 959-967, 2007 | 23 | 2007 |
| A hybrid method for bubble geometry reconstruction in two-phase microchannels EN Wang, S Devasenathipathy, H Lin, CH Hidrovo, JG Santiago, ... Experiments in Fluids 40, 847-858, 2006 | 21 | 2006 |
| Thermal compression bonding process cooling manifold H Dhavaleswarapu, Z Li, J Petrini, SB Roach, S Devasenathipathy, ... US Patent 9,282,650, 2016 | 20 | 2016 |
| A study of the flow field in a model rotor-stator disk cavity RP Roy, S Devasenathipathy, G Xu, Y Zhao Turbo Expo: Power for Land, Sea, and Air 78606, V003T01A064, 1999 | 19 | 1999 |
| Thermal assemblies for multi-chip packages Z Wan, JY Chang, CP Chiu, S Devasenathipathy, BK Gebrehiwot, CM Jha US Patent 11,456,232, 2022 | 12 | 2022 |
| Dual side die packaging for enhanced heat dissipation Z Wan, S Devasenathipathy, CP Chiu, CM Jha, W Tang US Patent App. 16/153,392, 2020 | 12 | 2020 |
| Stacked die architectures with improved thermal management F Eid, S Kothari, CM Jha, JM Swan, MJ Baker, SM Liff, TL Sounart, ... US Patent App. 15/866,793, 2019 | 12 | 2019 |
| Separation technique of sub-micron particles using electrokinetically driven flow T Yamamoto, S Devasenathipathy, Y Sato, K Hishida Nippon Kikai Gakkai Ronbunshu, B Hen/Transactions of the Japan Society of …, 2004 | 10 | 2004 |
| Liquid velocity field measurements in two-phase microchannel convection E Wang, S Devasenathipathy, CH Hidrovo, DW Fogg, JM Koo, ... Proc. 3rd International Symposium on Two-Phase Flow Modeling and …, 2004 | 8 | 2004 |
| High performance transient uniform cooling solution for thermal compression bonding process Z Li, HK Dhavaleswarapu, JB Petrini, S Devasenathipathy, SB Roach, ... US Patent 9,434,029, 2016 | 7 | 2016 |
| Socket loading mechanism for passive or active socket and package cooling SA Klein, Z Wan, CP Chiu, S Devasenathipathy US Patent 11,646,244, 2023 | 6 | 2023 |
| Electrokinetic particle separation S Devasenathipathy Micro Total Anal. Syst. 2003, 845-848, 2003 | 5 | 2003 |
| Filled liquid metal thermal interface materials KJ Arrington, A Mccann, K Lofgreen, AR Antoniswamy, ... US Patent App. 16/662,562, 2021 | 4 | 2021 |
| Contact Pressure and Load Measurement Techniques for Applications in Semiconductor Packaging S Yagnamurthy, S Klein, N Haehn, S Reynolds, T Harirchian, CP Chiu, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1019-1026, 2016 | 4 | 2016 |
