| Fabrication of porogen residues free and mechanically robust low-k materials AM Urbanowicz, P Verdonck, D Shamiryan, K Vanstreels, M Baklanov, ... US Patent App. 12/831,935, 2011 | 447 | 2011 |
| Metal-organic framework ZIF-8 films as low-κ dielectrics in microelectronics S Eslava, L Zhang, S Esconjauregui, J Yang, K Vanstreels, MR Baklanov, ... Chemistry of Materials 25 (1), 27-33, 2012 | 272 | 2012 |
| Soft, comfortable polymer dry electrodes for high quality ECG and EEG recording YH Chen, MO de Beeck, L Vanderheyden, E Carrette, V Mihajlović, ... Sensors 14 (12), 23758-23780, 2014 | 253 | 2014 |
| Cu pumping in TSVs: Effect of pre-CMP thermal budget I De Wolf, K Croes, OV Pedreira, R Labie, A Redolfi, M Van De Peer, ... Microelectronics Reliability 51 (9-11), 1856-1859, 2011 | 139 | 2011 |
| Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV C Okoro, K Vanstreels, R Labie, O Lühn, B Vandevelde, B Verlinden, ... Journal of Micromechanics and Microengineering 20 (4), 045032, 2010 | 119 | 2010 |
| Atomic layer deposition of ruthenium with TiN interface for sub-10 nm advanced interconnects beyond copper LG Wen, P Roussel, OV Pedreira, B Briggs, B Groven, S Dutta, ... ACS applied materials & interfaces 8 (39), 26119-26125, 2016 | 111 | 2016 |
| Improving mechanical robustness of ultralow- SiOCH plasma enhanced chemical vapor deposition glasses by controlled porogen decomposition prior to UV … AM Urbanowicz, K Vanstreels, P Verdonck, D Shamiryan, S De Gendt, ... Journal of Applied Physics 107 (10), 104122, 2010 | 98 | 2010 |
| Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu C Okoro, R Labie, K Vanstreels, A Franquet, M Gonzalez, B Vandevelde, ... Journal of Materials Science 46 (11), 3868-3882, 2011 | 89 | 2011 |
| Ruthenium metallization for advanced interconnects LG Wen, C Adelmann, OV Pedreira, S Dutta, M Popovici, B Briggs, ... Interconnect Technology Conference/Advanced Metallization Conference (IITC …, 2016 | 75 | 2016 |
| Effect of porogen residue on chemical, optical, and mechanical properties of CVD SiCOH low-k materials AM Urbanowicz, K Vanstreels, D Shamiryan, S De Gendt, MR Baklanov Electrochemical and Solid-State Letters 12 (8), H292-H295, 2009 | 63 | 2009 |
| Mechanical stability of porous low-k dielectrics K Vanstreels, C Wu, MR Baklanov ECS Journal of Solid State Science and Technology 4 (1), N3058-N3064, 2015 | 58 | 2015 |
| Ultra-low-k cyclic carbon-bridged PMO films with a high chemical resistance F Goethals, I Ciofi, O Madia, K Vanstreels, MR Baklanov, C Detavernier, ... Journal of Materials Chemistry 22 (17), 8281-8286, 2012 | 58 | 2012 |
| Effect of pore structure of nanometer scale porous films on the measured elastic modulus K Vanstreels, C Wu, M Gonzalez, D Schneider, D Gidley, P Verdonck, ... Langmuir 29 (38), 12025-12035, 2013 | 54 | 2013 |
| Atomic Layer Deposition of Ruthenium Thin Films from (Ethylbenzyl)(1-Ethyl-1, 4-cyclohexadienyl) Ru: Process Characteristics, Surface Chemistry, and Film Properties M Popovici, B Groven, K Marcoen¶, QM Phung, S Dutta, J Swerts, ... Chemistry of Materials 29 (11), 4654-4666, 2017 | 53 | 2017 |
| Analysis and modeling of the high vacuum scanning spreading resistance microscopy nanocontact on silicon P Eyben, F Clemente, K Vanstreels, G Pourtois, T Clarysse, E Duriau, ... Journal of Vacuum Science & Technology B, Nanotechnology and …, 2010 | 50 | 2010 |
| Degradation of 248 nm deep UV photoresist by ion implantation D Tsvetanova, R Vos, G Vereecke, TN Parac-Vogt, F Clemente, ... Journal of The Electrochemical Society 158 (8), H785-H794, 2011 | 46 | 2011 |
| Effect of UV wavelength on the hardening process of porogen-containing and porogen-free ultralow- plasma-enhanced chemical vapor deposition dielectrics AM Urbanowicz, K Vanstreels, P Verdonck, E Van Besien, T Christos, ... Journal of Vacuum Science & Technology B, Nanotechnology and …, 2011 | 44 | 2011 |
| Formation, processing and characterization of Co–Sn intermetallic compounds for potential integration in 3D interconnects G Vakanas, O Minho, B Dimcic, K Vanstreels, B Vandecasteele, ... Microelectronic Engineering 140, 72-80, 2015 | 40 | 2015 |
| 3D stacking induced mechanical stress effects V Cherman, G Van der Plas, J De Vos, A Ivankovic, M Lofrano, V Simons, ... Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 309-315, 2014 | 36 | 2014 |
| Intrinsic effect of porosity on mechanical and fracture properties of nanoporous ultralow-k dielectrics K Vanstreels, C Wu, P Verdonck, MR Baklanov Applied Physics Letters 101 (12), 123109, 2012 | 35 | 2012 |
