Flip-chip bonding of VCSELs to silicon grating couplers via SU8 prisms fabricated using laser ablation
KS Kaur, AZ Subramanian… - 2015 European …, 2015 - ieeexplore.ieee.org
2015 European Conference on Optical Communication (ECOC), 2015•ieeexplore.ieee.org
… Abstract We successfully demonstrate for the first time, VCSEL-to-silicon grating coupler
flip-chip assembly using SU8 prism fabricated by non-uniform laser ablation. Excess loss of
< 1 dB and data transmission up to 20 Gb/s @ 1550 nm was achieved. … In order to
circumvent the above mentioned issues, we present a laser-based, contactless and single-step
process to fabricate polymer prisms on top of the GCs. It is a simple, fast, flexible and wafer-scalable
process. In this paper, we demonstrate for the first time the … To conclude, flip-chip bonding …
flip-chip assembly using SU8 prism fabricated by non-uniform laser ablation. Excess loss of
< 1 dB and data transmission up to 20 Gb/s @ 1550 nm was achieved. … In order to
circumvent the above mentioned issues, we present a laser-based, contactless and single-step
process to fabricate polymer prisms on top of the GCs. It is a simple, fast, flexible and wafer-scalable
process. In this paper, we demonstrate for the first time the … To conclude, flip-chip bonding …
We successfully demonstrate for the first time, VCSEL-to-silicon grating coupler flip-chip assembly using SU8 prism fabricated by non-uniform laser ablation. Excess loss of <; 1 dB and data transmission up to 20 Gb/s @ 1550 nm was achieved.
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