Method of forming three dimensional integrated circuit devices using layer transfer technique
Z Or-Bach, D Sekar, B Cronquist, Z Wurman - US Patent 8,642,416, 2014 - Google Patents
US8642416B2 - Method of forming three dimensional integrated circuit devices using layer
transfer technique - Google Patents US8642416B2 - Method of forming three dimensional …
transfer technique - Google Patents US8642416B2 - Method of forming three dimensional …
Method of forming three dimensional integrated circuit devices using layer transfer technique
Z Or-bach, D Sekar, B Cronquist… - US Patent …, 2014 - freepatentsonline.com
A method for formation of a semiconductor device including a first wafer including a first
single crystal layer comprising first transistors and first alignment mark, the method …
single crystal layer comprising first transistors and first alignment mark, the method …
Semiconductor device and structure
Z Or-Bach, D Sekar, B Cronquist… - US Patent App. 13 …, 2013 - Google Patents
US20130122672A1 - Semiconductor device and structure - Google Patents
US20130122672A1 - Semiconductor device and structure - Google Patents Semiconductor …
US20130122672A1 - Semiconductor device and structure - Google Patents Semiconductor …
SEMICONDUCTOR DEVICE AND STRUCTURE
Z Or-bach, D Sekar, B Cronquist… - US Patent App. 13 …, 2013 - freepatentsonline.com
A method for formation of a semiconductor device including a first wafer including a first
single crystal layer comprising first transistors and first alignment mark, the method …
single crystal layer comprising first transistors and first alignment mark, the method …