Microsystems for Radio Frequency (RF) passive elements, known as RF-MEMS, have been attracting the attention of academic and industrial research since their first discussion, thanks to the remarkable performance they can trigger. Despite the flattering premises, RF-MEMS technology did not score consistent spread into mass-market applications, yet, as technical issues still needed to be managed, but also because consumer products did not use to really need such pronounced characteristics. Nowadays, the application scenarios of 5G (i.e. 5th generation of mobile communications and networks) and of the Internet of Things (IoT), highlight a growing need for cutting edge performance that RF-MEMS are capable of addressing. Given such a context, this short communication discusses an RF-MEMS series ohmic micro-switch, electrostatically driven and fabricated in a surface micromachining process, exhibiting good characteristics up to 110 GHz. In brief details, the micro-relay shows isolation (when OPEN) better than −15 dB and loss (when CLOSE) better than −1 dB up to 40 GHz. The actuation voltage is around 50 V, although it can be lowered acting on the release step temperature. Despite the design concept admits margins for improvement, the characteristics of the micro-switch reported in the following are already quite interesting in the discussion of next generation of RF passive components for 5G and IoT.