Nanopatterning technologies of 2D materials for integrated electronic and optoelectronic devices

S Liu, J Wang, J Shao, D Ouyang, W Zhang… - Advanced …, 2022 - Wiley Online Library
With the reduction of feature size and increase of integration density, traditional 3D
semiconductors are unable to meet the future requirements of chip integration. The current …
被引用次数：39 相关文章

Nanopatterning Technologies of 2D Materials for Integrated Electronic and Optoelectronic Devices.

S Liu, J Wang, J Shao, D Ouyang, W Zhang… - … (Deerfield Beach, Fla …, 2022 - europepmc.org
With the reduction of feature size and increase of integration density, traditional 3D
semiconductors are unable to meet the future requirements of chip integration. The current …

Nanopatterning Technologies of 2D Materials for Integrated Electronic and Optoelectronic Devices

S Liu, J Wang, J Shao, D Ouyang… - Advanced …, 2022 - ui.adsabs.harvard.edu
With the reduction of feature size and increase of integration density, traditional 3D
semiconductors are unable to meet the future requirements of chip integration. The current …

Nanopatterning Technologies of 2D Materials for Integrated Electronic and Optoelectronic Devices

S Liu, J Wang, J Shao, D Ouyang… - Advanced …, 2022 - pubmed.ncbi.nlm.nih.gov
With the reduction of feature size and increase of integration density, traditional 3D
semiconductors are unable to meet the future requirements of chip integration. The current …