Low-k integration: Gas screening for cryogenic etching and plasma damage mitigation

R Chanson, R Dussart, T Tillocher… - Frontiers of Chemical …, 2019 - Springer
… interconnects processing. In the present paper, we focus on porous SiOCH low-k damage
… Then, the impact of wettability for condensation is demonstrated. These first results enable a …

Plasma induced damage reduction of ultra low-k dielectric by using source pulsed plasma etching for next BEOL interconnect manufacturing

JK Jang, HW Tak, YJ Shin, D San Kim… - IEEE Transactions on …, 2020 - ieeexplore.ieee.org
… reduction methods in the etching of porous low-k dielectric, … ) processes and, the effects of
pulsed plasmas on the PID of … and the three peaks related to the low-k structure which are ‘Si-O…

Etch damage reduction of ultra low-k dielectric by using pulsed plasmas

JK Jang, HW Tak, KC Yang, YJ Shin, JY Hyeon… - ECS …, 2019 - iopscience.iop.org
… reduction methods in the etching of porous low-k dielectric using … Before investigating the
effect of RF pulsing, the etching by … structure from Si-O-CH structure during the plasma etching

Effect of terminal methyl group concentration on critical properties and plasma resistance of organosilicate low-k dielectrics

AA Rezvanov, AV Miakonkikh, DS Seregin… - Journal of Vacuum …, 2020 - pubs.aip.org
… of porous low-k dielectrics is a complex process involving … reduced degradation during
plasma etching processes. These … A more detailed deposition process and the porous structure

Cryo Plasma Etching of Porous Low-k Dielectrics

AV Miakonkikh, VO Kuzmenko, KV Rudenko - High Energy Chemistry, 2023 - Springer
… the atomic layer process of anisotropic plasma etching with low … effect is etching at
significantly low temperatures. … porous structure from deep penetration of active plasma radicals. …

Damage to porous SiCOH low-k dielectrics by O, N and F atoms at lowered temperatures

DV Lopaev, SM Zyryanov, AI Zotovich… - Journal of Physics D …, 2020 - iopscience.iop.org
… of the chemical structure of an OSG, due to the effects of different … Unsurprisingly, the main
processes determining low-k … that under conventional conditions for low-k etching [6], plasma …

Etch characteristics of nanoscale ultra low-k dielectric using C3H2F6

HW Tak, JK Jang, D Sung, DS Kim, DW Kim… - Materials …, 2020 - ingentaconnect.com
… for porous SiCOH by using plasma etching methods such as … etch characteristics of porous
SiCOH such as etch rate, etch … , therefore, its green house effect can be much lower than …

Methylated porous low-k materials: critical properties and plasma resistance

AA Rezvanov, AV Miakonkikh… - … on Micro-and Nano …, 2022 - spiedigitallibrary.org
… in the modern process flows to reduce the negative impact of … by the formation of a porous
structure due to the removal of … of demethylated low-k can move at the same speed as the etch

[HTML][HTML] Impact of VUV photons on SiO2 and organosilicate low-k dielectrics: General behavior, practical applications, and atomic models

MR Baklanov, V Jousseaume, TV Rakhimova… - Applied Physics …, 2019 - pubs.aip.org
… and generate porosity in organosilicate (OSG) low-k films. … related to plasma processing (dry
etch, plasma assisted … phase removal, creation of porous structure, and strengthening of the …

Metal barrier induced damage in self-assembly based organosilica low-k dielectrics and its reduction by organic template residues

M Krishtab, JF de Marneffe, S Armini… - Applied Surface …, 2019 - Elsevier
… of the low-k dielectrics and their pore structure, eg by … The impact of the deposition process
on low-k dielectric layer … of the etching process which may strongly roughen a porous low-k