Role of through silicon via in 3D integration: Impact on delay and power

S Chandrakar, D Gupta… - Journal of Circuits, Systems …, 2021 - World Scientific
… , and polysilicon were used as … impact of the via bump and inter-metal dielectric (IMD) layer.
Therefore, extensive analysis and novel modeling are required to obtain improved crosstalk, …

Crosstalk reduction in copper on‐chip interconnects with graphene barrier for ternary logic applications

DM Badugu - … Journal of Circuit Theory and Applications, 2020 - Wiley Online Library
From Figure 3B, it is observed that the peak crosstalk noise … the shielded interconnect line
between the coupled interconnects, … logic integrated circuits to investigate the crosstalk issues. …

RF performance of devices processed in low-temperature sequential integration

TM Frutuoso, P Sideris, J Lugo-Alvarez… - … on Electron Devices, 2021 - ieeexplore.ieee.org
… Finally, we illustrate the crosstalk effects and the influence of … We also show that a polysilicon
ground shield integrated … of RF and mmWave-integrated circuits. Silicon on insulator (SOI) …

Integrated digital and analog circuit blocks in a scalable silicon carbide CMOS technology

J Romijn, S Vollebregt, LM Middelburg… - … on Electron Devices, 2021 - ieeexplore.ieee.org
… voltage SiC technology for integrated circuits is of paramount … a single metal interconnect
layer, and polysilicon can be used … This helps reduce crosstalk or latch-up between the devices, …

Interconnect Processing: Integration, Dielectrics, Metals

ST Chen, NA Lanzillo, S Van Nguyen, T Nogami… - Springer Handbook of …, 2022 - Springer
… in the manufacturing of integrated circuits over the past 50 … , the integrated memory and
logic, and the cross talk between … F for dielectric and aluminum and polysilicon for wiring. At this …

Investigation of crosstalk issues for MWCNT bundled TSVs in ternary logic

JB Shaik, P Venkatramana - ECS Journal of Solid State Science …, 2022 - iopscience.iop.org
integrated circuit emphasis (HSPICE) simulations, the effects … as gold, tungsten, polysilicon,
metallic polymer paste, and … In this section, the impact of driver size and line resistance on …

Heterogeneous and monolithic 3D integration technology for mixed-signal ICs

J Jeong, DM Geum, SH Kim - Electronics, 2022 - mdpi.com
… fabrication and basic readout functions of integrated circuits. … and poly-Si gate. The
heterogeneous and monolithic 3D … in the same chip induces the crosstalk between them. …

Planar CMOS Process Flow for Digital, Mixed-Signal, and RFCMOS Applications

EN Shauly - Design Rules in a Semiconductor Foundry, 2022 - taylorfrancis.com
polycrystalline silicon layer with a high-conductivity metal … is the substrate for integrated
circuits. The wafer properties … to latchup and cross-talk between transistors. Examples of the …

Parasitic coupling in 3D sequential integration: The example of a two-layer 3D pixel

P Sideris, A Peizerat, P Batude, G Sicard, C Theodorou - Technologies, 2022 - mdpi.com
… different electrodes for a 3D Sequential Integration circuit … End Of Line (BEOL) thickness,
inducing losses and crosstalk … that the integration of an inter-tier GP made of polysilicon can …

Crosstalk suppression in CMOS terahertz detectors by using a mushroom-like AMC structure

K Wang, Y Liao, Y Guo, S Zhou, J Liu, F Yan, X Ji - Optics Express, 2023 - opg.optica.org
… Under the theory of transmission lines and periodic circuits, M… ; (b) To shape the gate of
MOSFET and polysilicon antenna; (… ; (f) Metal patch of M-AMC is deposited using first metal layer. …